MD-F5100 Series 50W 3-axis fiber laser marker is compact and fanless. IP64 rating (head unit) permits use demanding manufacturing environments. Internal components not affected by hazardous elements such as dirt, dust, water, and oil mist. New functions include scratch control and deep engraving. Permits consistent marking quality on 3D surfaces and the far edges of the marking field (300 x 300 mm). Eliminate changes in character shape, distortion, and beam spot size variations.

Keyence, www.marking-central.com/PRMDF5

Q300 table top vapor phase reflow machine is compact and self-contained, with the process zone, lift and work piece carrier integrated into a single support structure. Surface heater units are attached to the outside of the chamber and insulated against external heat radiation. Is portable and flexible. With the Asscon desolder tool, can be used for safe repair and rework of assemblies.

Asscon, www.asscon.de

Circuit Board Cleaning Station is a ready-to-use benchtop cleaning station. Kit features 12 oz. can of SUPRCLEAN Flux Remover, which reportedly removes 100% of flux, oil and acrylic conformal coating. Includes reusable Trigger Grip, Bench Mounting Kit, and package of 50 lint-free dry wipes.

Microcare, www.microcare.com

E-Line Zero-VOC general cleaner is for degreasing and removing sticky adhesive residues such as uncured adhesive from stencils and conformal coating from printed circuit boards. E-Line Hi-Flash maintenance cleaner is a non-chlorinated, low odor degreaser and electrical cleaner. Slower evaporation permits the solvent to soak in and break down soils. Ignites at temperatures over 140°F and has low toxicity.

Techspray, www.techspray.com
 

HD Mobile x-ray fluorescence analyzer provides screening and quantification for lead at levels below regulatory limits defined in the Consumer Product Safety Improvement Act for coatings and substrates such as metal, glass and plastics. Features integration into case design for stationary use. “Smart case” houses removable handheld analyzer, and serves as a charging/docking station and a stationary test instrument. ASTM F2853-10 compliant.

XOS, www.xos.com/hdxrf

ProFlex selective laser soldering has an XYZ gantry, generous soldering areas, and comprehensive graphic user interface. Gantry can be scaled from 8" to 8' to meet most soldering application requirements. The 70 lb. capable gantry permits multiple tooling to be attached to the end effector, so a single head can perform multiple functions, or additional heads can be added to increase output, place paste and then solder, preheat (hot air) and then solder, and more. Comes in tabletop, rotary table, dual slide shuttle, inline conveyor, hover over top of a Bosch conveyor, and other configurations. Windows based control platform.

ProMation Inc., pro-mation-inc.com

A500 benchtop solder paste inspection system automatically finds fiducials, identifies pads, and retains height and volume data for each pad. Shows pads outside thresholds in real-time. Retains historical data. Offers 3-D views, with measurement speeds up to 17 cm²/sec. XY motion permits automatic scanning of PCB panels up to 300 x 300mm. Z-axis motion permits auto-focus of the sensor and board warpage compensation. Accepts Gerber.

VisionMaster, www.visionmasterinc.com

Wizard Stencil Stretch Frame system changed and tensions stencils using simple, adaptable components and readily-available shop air (compressed). Consists of two frame components plus the stencil foil. A patented molded plastic Container Frame holds the stencil foil for handling, mounting, and space-saving storage, using 64 to 80 contact points to hold the foil stencil in place, and protects workers from injuries during handling. When ready to mount for printing, the Container Frame and stencil are mounted in the adjustable, durable, lightweight aluminum frame assembly Stencil tension can be modified in all directions with the amount of air pressure applied. Requires less storage space (since stencil foils can be stored in their compact plastic Container Frames) and eliminates need for epoxy bonding of the stencil foil to a cast frame. Come in three sizes and three types of plastic composition for specific applications.

QTS, Inc., www.QTSframe.com

F05 Poly-forms are flexible pre-shaped adhesives designed for bonding diverse materials, including metals, plastics, and glass. Has negligible vertical flow, keeping the adhesive contained in defined areas. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is reportedly consistent from bond to bond. Temp. and time required depend on component materials, design, bond requirements, and operating environment. Adding pressure and increasing oven temperature and time improves adhesion. Min. processing temp. is 225°F (107°C).  A typical processing schedule is 275°F (135°C) for 10 min. under 5 psi.

Multi-Seals, www.multi-seals.com

MT Series precision metal tapper tips deliver high fluid flow rates, for high-speed dispensing. Smooth internal conical fluid flow path is said to increase performance and reduce clogging and back pressure, permitting higher flow rates. Metal construction aids in robotic or other precise applications. Thin wall design at the tip enhances dispensing accuracy while simultaneously lessening fluid tailing and stringing. Come in 18 to 30 gauge sizes, and are color-coded for easy identification. 

Techcon Systems, www.techconsystems.com

Y.FGUI (Yxlon FeinFocus Graphical User Interface) v. 3.5 system control software has easy-to-use one-click operation for capturing high-resolution radioscopic images. Based on the ASTM E2597 standard, and provides a quality toolkit for automatic calculation of spatial resolution and the signal-to-noise ratio in order to evaluate system qualification. Reduced presettings improve user guidance for BGA inspection. Automatic grid search and algorithm optimization aid precision in analyzing soldered balls. Equipped with Windows 7 64-bit version. For use in Y.Cougar and Y.Cheetah x-ray systems.

Yxlon International, www.yxlon.com

Polytec PT thermally conductive epoxies include single and two-part systems designed for heat transfer applications. Applications include chip bonding, heat sink bonding, thermistors, LED assembly and power semiconductor packaging. Thermal conductivity ranges up to 3 W.m-1.K-1. Come in twin packs or as premixed and frozen syringes.

Intertronics, www.intertronics.co.uk