Atron SP 200 reportedly effectively removes all screened Pb-free flux residues on standard solder pallets at concentrations of 10 to 20% at different operating temperatures. Is surfactant-based; bath life is said to be up to 10 times longer compared to conventional surfactant-based cleaners. Full material compatibility demonstrated across various manufacturers. Is halogen-free and environmentally friendly. Meets RoHS and WEEE guidelines.
The LED Production Systems brochure contains comprehensive information on production and processing of LEDs. The eight-page document includes information about manufacturing lenses at board level, phosphor-encapsulation, and assembling of LEDs on flex-boards. Outlines processes and shows the application possibilities of dispensing systems, placement machines, solder and curing systems.
Friendlygreen.org was created to offer commercial clients alternatives in sustainable, green technologies and operational efficiency enhancements. Provides information on earth-friendly alternatives to industry standard products. Will introduce proven, point-up strategies to assist in reducing daily operational costs and extending the lifecycle of equipment and procedures.
SX45 stereo zoom microscope reportedly has long-life LED illumination. A trinocular viewing attachment may be used; a digital or USB camera is optional. Multimedia solutions are available for image archiving, acquisition, processing, analysis and documentation. Other options include bench stand, boom mount, and articulated arm. Has a zoom ratio of 6.3:1 and a magnification of x50.
Weller WHP200 under-board heater is designed to speed up repair of small multilayer PCBs. Is said to offer easy temperature adjustment. An infrared plate provides controlled heating. Set temperature and actual temperature are digitally displayed. Includes a PCB board holder.
Sarcon XR-Pe is a putty-like thermal interface material. Is said to help improve semiconductor performance by transferring unwanted heat to a nearby heat sink. Is silicone-based and conforms to most CPU and semiconductor shapes with a low compression force requirement. Is maintained for applications that require up to 90% material compression. Reportedly offers thermal conductivity of 11 watt/m-k with a broad operating temperature from -60°C to +200°C. Is available in 2.0 or 1.5-mm thick sheets up to a maximum dimension of 300 mm x 200 mm. Can be ordered in die-cut form.