New Products
TechniShield is a plating process for individual shielding of active components. Offers direct plating to the molding compound; is said to create nonporous deposit that eliminates the need for metal caps or lids. Uses novel chemistry to roughen and plate the epoxy molding compound. Is chrome-free. Reportedly maintains excellent adhesion through multiple reflows and produces a pore-free surface.
Technic Inc., www.technic.com
Technic Inc., www.technic.com
2200-545 Series adjustable stroke mix-dispense valves are designed for controlled flow of 2-component adhesives and sealants, such as silicones, epoxies, urethanes and acrylics. Are based on the No-Drip valve body design for fluid control, featuring the integration of carbide ball-end needles and carbide seats. The adjustable stroke feature permits the operator to fine-tune the flow rate by rotating the threaded stem on the back of the valve. The valve is also available with an eyelet stem for attaching to a tool balance. Are 2.25" in diameter by 5.5" long, and are rated for 3,500 psi (240 bar). Double air actuated with two 1/8 NPT ports for a 4-way pneumatic valve connections. Body has two 1/4 NPT fluid inlet ports for Part A and B materials and accepts a wide variety of motionless mixers; has two screw holes and two dowel holes.
Sealant Equipment & Engineering Inc., www.SealantEquipment.com/2200-545
Sealant Equipment & Engineering Inc., www.SealantEquipment.com/2200-545
Bondjet BJ820 automatic wedge bonder, for round wire and deep access ribbon and wire bonding, is said to handle fine-pitch applications on a single platform, including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive – using aluminum or gold wire or ribbon. Reportedly has speeds up to 7 wires/sec. Axis repeatability of 1 μm at a balanced encoder resolution of 20 nm. A 12" x 16.1" work area can serve as two or more smaller stations. Capabilities include 12.5 to 85 μm diameter wire bonding; ribbon bonding from 6 x 35 μm to 25 x 250 μm; constant loop height and wire length; parallel loops within mixed reference system; auto teach for linear applications. Has a footprint of 720 x 1250 mm.
Hesse & Knipps, www.hesse-knipps.com
Conap Conathane EN-3010 is a filled two-component polyurethane potting compound. Is UL94 V-O recognized and RoHS compliant. Is flexible and is said to have a fast cure rate and low viscosity. Reportedly exhibits mix of 70 Shore A hardness, 100% modulus of 668 psi, and 139% elongation; has processing properties of 2,400 cps mixed viscosity at 25° C, 2:1 volumetric mix ratio, fast gellation, excellent storage stability, and a non-abrasive filler. Is suited for aerospace, automotive, computer, and defense SMT applications.
Cytec Industries Inc., www.cytec.com/conap
The Amkor 15 mmm Dummy PoP comes in a 0.65 mm pitch with a 160 I/O top and a 0.5 mm pitch, 605 I/O bottom. Is for PSvfBGA. Is the mechanical equivalent of a live component used only when physical properties are required.
Practical Components Inc., www.practicalcomponents.com
Select Technomelt hot melt adhesives are offered in finger-sized, ready-to-use packets. Load directly into the dispensing tank; the dry outer casing melts with the adhesive. Designed to replace sticky cavity packaging and plastic waste. Are available in 28 lb. boxes. Available in ethylene-vinyl-acetate, polyolefin and pressure sensitive technologies. Are used to manufacture filters, packaging, pressure sensitive adhesive films, insulation, textiles, vehicles, and structures.
Henkel Corp., http://www.henkelna.com
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