Multicore LF700 lead-free, halide-free solder paste is said to reduce voiding in BGA solder joints, deliver high tack force and offers long printer abandon times of up to 4 hrs., even when printed on 0.4 mm CSP apertures. Is said to be solderable over a range of reflow profiles in both air and nitrogen and effective on several surface finishes including NiAu, immersion tin, immersion silver and OSP copper. 

Henkel, www.henkel.com/electronics

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