New Products
A new, longer Pyramax reflow oven features 350ºC maximum temperature, a flexible platform configuration and a comprehensive menu of options. Capabilities include reduced nitrogen consumption and lower power use. Features closed-loop convection control.
BTU International, www.btu.com
BTU International, www.btu.com
The TV-1000 Vacuum-Tweezer is said to permit handling of parts from 0.10" to several inches in diameter. The long-life diaphragm vacuum pump generates up to 10" of mercury with an open-air flow of 2.3 lpm. Is ESD-safe. Has three-wire power cord. Small-parts tips handle items down to 100 µm and pickup heads with two or three pickup points handle larger parts.
Virtual Industries Inc., www.virtual-ii.com
Flashstream will support up to 32 Gb by year-end. Speed has incorporated use of cache-programming modes in select devices, reportedly pushing top speed on NAND memory to 8.23 Mb per sec. data transfer during programming. Now supports MLC flash memory using a bit error rate tolerance method. Managed NAND architecture like eSD/eMMC such as Samsung MoviNAND, Micron e-MMC, and Sandisk iNAND are now supported. Vector Engine has been enhanced with address-data multiplexed (A/D MUX) NOR devices. Bad block management options in the BPWin software have been enhanced; reportedly more than 90% of “standard” bad block management schemes can be addressed without the need for customization. Bad block parameters permanently can be recorded to the master-programming file and transferred to manufacturing facilities globally. Now available in multiple automated handling systems.
BPM Microsystems, www.bpmmicro.com
This thermal die lid attach adhesive is said to replace using two existing materials, such as a thermal interface material and a lid attach adhesive. Uses non-silicone polymer. Polymer is filled for high conductivity; additives are used to improve material properties. Reportedly shows little or no change in thermal conductivity, as measured by laser flash methods and adhesion, based on shear testing, after 150 cycles under standard reliability testing.
Lord Corp., www.lord.com
Lord Corp., www.lord.com
Gelease material has some cross-linking; reportedly has strength to stay in place and does not pump out. Gel is soft; absorbs movement of surfaces caused by CTE differences of assembled parts. Is built on the same cure chemistry as MG121, but reportedly offers higher conductivity, lower modulus and an improved thermal conductivity value (3.8 W/mK). Was designed for syringe dispensing or stencil printing. Is said to be ideal for automotive and consumer electronics.
Lord Corp., www.lord.com
Lord Corp., www.lord.com
ME-542 thermally conductive flip chip underfill is said to offer improved thermal path for heat reduction. Was designed to achieve high reliability for in-package or chip-on-board applications and to increase thermal dissipation from the die into the substrate. Has high copper content in substrate. Has thermal conductivity of 0.8 W/mK, a reported 500% increase over standard underfill products. Is engineered to quickly flow into gaps less than 25 µm with minimal filler settling and no voiding, encapsulating interconnect arrays with a layer of protective polymer.
Lord Corp., www.lord.com
