Circuits Assembly Online Magazine - New Products

New Products

Rehm Pyrolysis is a low-maintenance residue management system deployed within the heating zones of VXP convection reflow ovens. Thermally induces decomposition of organic compounds. Complex molecules are broken down into simpler substances with the use of high temperatures (500°C-900°C) taking place in a largely oxygen free (anaerobic) environment to avoid burning. Remaining residues are then captured within a special granulate. Granulate exchange required at 12-month intervals.
Rehm Thermal Systems, www.rehm-group.com

CSM7200 features fully automatic SMD placement and fabricates all current components up to 40 x 40 mm and offers integrated glue or solder paste dispensing. Graphical user surface simplifies controlling and programming. Programmable intelligent feeders have bar code readers to eliminate errors at changeover. “On-the-fly” laser measuring system.

Essemtec, www.essemtec.com

Easy Oven Setup software for reflow ovens automatically calculates the best reflow oven settings based on product and process limits. Uses new search engine to process thousands of oven settings before recommending options. Can run the product through the oven to create a profile, enter the process limits, and EOS calculates the optimal recipe.

Datapaq, www.datapaq.com

ESD drawer storage cabinets are certified to meet specific electrical property requirements, reportedly assuring static dissipation at a safe rate. Can be protected by static dissipative powder coat finishes in three standard colors. Drawer interiors can contain conductive plastic boxes and slotted grooved trays. Feature either a 440 lb. or 165 lb. load capacity each, and are available in six full sidewall heights. Drawer handles are positioned at the top of each drawer and are flush with the face of the housing. The one-drawer-at-a-time PrevenTip safety system prevents accidental cabinet tipping.

Lista International Corp., www.listaintl.com

UltraSlic FG solder paste stencil has paste release below surface area ratios of 0.5. Uses Datum Alloys’ fine grain stencil material. Is said to provide superior aperture registration, higher performance and lower cost compared to electroform. Step stencils optional.

Fine Line Stencil, www.finelinestencil.com

VPS Condenso Vacuum condensation reflow system is said to minimize void rates by subjecting the molten solder to a vacuum, removing residues and gas inclusions that would otherwise result in voids in the solidified joint. Reportedly can produce solder joints with surface contact ratios of greater than 99%. Releases even heat during condensation and maintains constant temperature. Limits maximum soldering temperatures so PCBs do not sustain damage from overheat.

Rehm Thermal Systems, www.rehm-group.com