Circuits Assembly Online Magazine - New Products

New Products

Icon i8 fully automatic screen printer now includes an under-stencil cleaner. Features dual-vacuum cleaning changers. Solvent holes tube now is said to be easier to remove from the main under-stencil cleaner body. Offers pad-on-pad verification, using DEK Hawkeye camera and inspection software.

Icon Technologies, www.iconprinter.com

Kester 295 no-clean flux is halide- and bromide-free. Designed for cored solder wire. Conforms to IPC-TM-650, IEC61189-2, J-STD-004A and JPCA-ES-01. Is said to eliminate splattering; removes need for expensive cleaning. Residues are non-conductive and non-corrosive and do not require removal. Is available in a variety of alloys, wire diameters and flux percentages. Classified as type ROLO flux per J-STD-004A; can be used for Pb- and Pb-free soldering. Emits low smoke and odor. Recommend solder iron tip temperature ranging between 260-370°C for Sn63Pb37 and 350-400°C for Pb-free SnAgCu alloys.

Kester, www.kester.com

Tape dispenser (item 81282) was designed for ESD tapes. Is made of stainless steel and holds tapes with 3" cores. Two separate spools turn independently to hold either a single 2" wide roll or two rolls 1" wide or narrower. All components can be grounded with ground cord. An integrated grounding jack can be used to plug in a wrist strap.

Desco, www.desco.com

A new, longer Pyramax reflow oven features 350ºC maximum temperature, a flexible platform configuration and a comprehensive menu of options. Capabilities include reduced nitrogen consumption and lower power use. Features closed-loop convection control.

BTU International, www.btu.com

The TV-1000 Vacuum-Tweezer is said to permit handling of parts from 0.10" to several inches in diameter. The long-life diaphragm vacuum pump generates up to 10" of mercury with an open-air flow of 2.3 lpm. Is ESD-safe. Has three-wire power cord. Small-parts tips handle items down to 100 µm and pickup heads with two or three pickup points handle larger parts.

Virtual Industries Inc., www.virtual-ii.com

Flashstream will support up to 32 Gb by year-end. Speed has incorporated use of cache-programming modes in select devices, reportedly pushing top speed on NAND memory to 8.23 Mb per sec. data transfer during programming. Now supports MLC flash memory using a bit error rate tolerance method. Managed NAND architecture like eSD/eMMC such as Samsung MoviNAND, Micron e-MMC, and Sandisk iNAND are now supported. Vector Engine has been enhanced with address-data multiplexed (A/D MUX) NOR devices. Bad block management options in the BPWin software have been enhanced; reportedly more than 90% of “standard” bad block management schemes can be addressed without the need for customization. Bad block parameters permanently can be recorded to the master-programming file and transferred to manufacturing facilities globally. Now available in multiple automated handling systems.

BPM Microsystems, www.bpmmicro.com