VP4000 4-channel vapor phase temperature profiler has a low mass, hermetically sealed RF data-logger with heat-shield, measuring 130 x 60 x 40 mm. Is capable of passing directly through the preheat, vapor reflow and vacuum stages. Profile data are continuously passed to a PC via two-way wireless RF link. Profile can be viewed in real time as boards are being soldered.
 
AutoSeeker automatic reflow process optimization software reportedly eliminates trial-and-error approach. Given a user profile, it uses a rules-based algorithm to search for the best machine settings. User criteria such as process window centered, fastest throughput or lowest running costs can be defined.
 
Solderstar Pro RF wave and reflow profiling is for reflow and wave solder temperature profiling. This scalable system permits reflow profiling on 6, 9, 12 or 16 channels. When used in conjunction with the Waveshuttle wave solder process analyzer, it forms a wave analysis tool capable of detailed wave temperature profile and wave contact measurements. Incorporates an ultra-compact RF data-logger that provides a two-way RF data link with a PC. Permits system setup, process improvements and data downloads to be performed efficiently and temperature profile to be analyzed in real time.
 
SolderStar Ltd., www.solderstar.eu

 

McDry MCU-401 Hepa Filter is for precision measuring instruments, electronics components, or other materials that require a cleanroom and low humidity environment. Meets cleanroom Class 1000 specifications. Using a fan circulation system, dry air passes through the hepa filter and is circulated throughout the cabinet and back down into the drying unit. Is said to maintain relative humidity inside the cabinet below 10%, and can hold up to 50 kg (approximately 110 lb). Comes with digital meter that displays the RH level at all times. Features adjustable stainless shelves and is equipped with a high resistance ground terminal.

Seika Machinery, www.seikausa.com

 

NL930 Pb-free, no-clean solder paste is said to feature good solderability, improve stencil life and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index and wetting characteristics. Post-reflow flux residues are penetrable. Is compatible with SN100C and SAC alloys with Type 3, 4 and 5 solder meshes, and with OSP, ENIG, immersion silver, and immersion tin finishes. Features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as good response to one-hour pause after two knead strokes at 35-65% RH.
 
FCT Assembly, www.fctassembly.com

 

Silver Zebra elastomeric connector is for most electronics packages. Uses a component-to-board or board-to-board design. Offers a current carrying capacity up to 0.700 A per square 0.040"; exhibits a contact resistance of less than 0.50 Ω. Creates redundant electrical contact; incorporates 240 alternating layers of silver-filled conductive elastomer and nonconductive silicone material per inch of connector. Provides a centerline pitch between layers of 0.004" and permits 0.015" pad spacing on the PCB. Is also available with an outer installation barrier.

Fujipoly America, www.fujipoly.com