Circuits Assembly Online Magazine - New Products

New Products

S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.

S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.

Koki Co. Ltd., www.ko-ki.co.jp

GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.

Seho Systems, www.sehona.com

SMT spring-loaded connectors are offered as discrete contacts; many are available in tape-and-reel packaging. Part family 0910-0 and 0910-1 through 4 are discrete SLCs specifically designed for production tape-and-reel assembly. Part 0967 is a horizontal mount SMT SLC designed for low-profile board-to-board interconnections. Feature a large base for either increased PCB stability or assembly in non-PCB applications such as a face plate. Part family 0990-0 and 0990-1 through 4 and 0997-0 through 9 offer a range of application heights from 0.137" to 0.430".

Mill-Max, www.mill-max.com

SolAg solar cell conductive adhesives and inks reportedly deliver efficient, long-lasting solar power. Are said to be superior in damp heat and thermal cycle aging. Deliver low, stable electrical contact resistance for silver grid buss lines, ribbon attachment and metal wrap-through in CIGS, amorphous silicon and similar thin film platforms.

Engineered Conductive Materials, www.conductives.com
Krayden Inc., www.krayden.com

Dual Lane Reflow Oven provides high- and low-volume SMT soldering in one reflow unit. Features flexible production in parallel and is compatible for both Pb-free and leaded SMT. Reportedly reduces floor space 47% compared to traditional dual-lane production lines. Contains two independent conveyor lanes and two heating areas. Has 18 independently programmable heating zones, with both top and bottom side heating areas. Conveyor speeds and widths are independently controlled and adjustable.

SEHO Systems GmbH, www.sehona.com

Multicore LF730 Pb-free solder paste uses DAP Plus Type 4 solder powder and a flux medium said to permit greater process latitude. Reportedly prints thorough apertures as small as 160 µm, permitting more solder per aperture with less risk of aperture clogging. Volume release is said to be over 90%.

Wets to a range of surface finishes, and can be used in environments from 30°C at 84% RH. Features open and abandon times of two to three hours, standard refrigeration storage, six-month shelf life and good hot slump resistance.

Henkel, www.henkel.com/electronics