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New Products

XT V 130 x-ray inspection system is compact and comes with a 30-130 kV open micro-focus x-ray source, 4-axis programmable manipulator and 16-bit imaging system based on a 4” image intensifier. Reports compliant with MRP systems. Focal spot size down to 3 microns, 320X geometric magnification and tilt angle up to 60°. Rotate stage and CT capability optional. Hinged door provides access to inspection area, which fits samples up to 40 x 35 cm (16 x 14”).

Nikon Metrology, www.nikonmetrology.com

PowerRepair is for de-soldering and soldering of through-hole components to PCBs. Features mini-wave soldering technology, able de-solder/solder high-pin-count components and connectors. Also handles components with high thermal mass (thick pins, multilayer boards etc.), and is compatible with all Pb-free solder alloys. Soldering nozzle is designed for high energy transfer rate, even in high-temperature applications. Features short repair cycles, and low thermal stress on the PCB and components.  All soldering parameters are programmable.

Seho Systems, www.sehona.com

Multicore DA101 incorporates a no-clean, ROLO flux and is formulated for printing processes. Is said to withstand temperatures of 300°to 330°C for high-Pb reflow profiles and Pb-free temperatures between 240° and 270°C. Wets to copper, NiPdAu and Ag finishes, among others. Exhibits less that 5% void instances on average. Can be cleaned with standard cleaning chemistries.

Henkel, www.henkel.com/electronics

PCB123 version 3.3 circuit board design software now can convert any layout design files; has full customization via software development kit; bill of materials generated and updated as user designs; offers real-time quotes for board fabrication and parts; can order both boards and parts direct from interface; and includes more fabrication options and services. Free.
 
Sunstone Circuits, www.sunstone.com

 

A thick film dielectric and conductor system improves the mounting of silicon ICs to aluminum substrates. Provides low thermal resistance between the chip and heat sink in applications such as HB LEDs. The glass system of the Pb- and Cd-free dielectric paste was developed to offer thermal conductivity on both 3003- and 6061-grade alloy aluminum substrates. Reduces bowing by closely matching the CTE of aluminum. Also, a Pb-free silver conductor paste, fired together at 550°C with the dielectric paste, provides solderability and adhesion. Is for applications such as direct-mounted LEDs.

 

Heraeus Thick Films Materials Business Unit, www.heraeus.com

Model 340PS and 340PSL positive-displacement dispensing valves for fluid dispensing incorporate the efficiency of a disposable fluid path from the reservoir to the dispense tip. Sequenced piston actuation dispenses a consistent shot-to-shot volume. Are effective with materials that are shear sensitive, extremely high or low in viscosity, possess tacky or stringy characteristics, or have drifting viscosities due to limited pot life. 340PS is suited for shot volumes from 0.004 to 0.180 mL. 340PSL offers shot size capability up to 1.200 mL. Both are available with polyurethane, flexible polyethylene or Teflon tubing.
 
Tridak, www.tridak.com

 

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