MSD 1200 Series dessicant cabinet is a modular, 0.5% RH cabinet for moisture sensitive device drying. Designed to exceed J-STS-033B.1. Includes a modular enclosure, with access from two sides that can be expanded to meet growing production, and a new dry unit with closed loop on-demand regeneration. U5001 "Dynamic Series" Zeolite dryer, for dehumidification, reportedly is capable of taking a basic MSD1212 from from 50%RH to less than 5% under unloaded conditions at 25°C in 240 sec. Optimal humidity levels are below 0.5% RH. Designed to regenerate only when necessary. Has a quiet and maintenance-free operation. Average power consumption is 30W per hr.
Totech, www.totech.eu.com
The fully enclosed, lockable SMT storage cabinet is available as an accessory to stockroom units; is only available in a shorter height. Is fully ESD-compliant. Features interchangeable shelves and subdividers. Is available in both single- and double-sided models. Doors are clear.
Bliss Industries, www.blissindustries.com
A-108 aluminum paste is printed as a back electrode on single or polycrystalline silicon solar cells. A-568 Pb-free silver front-side paste is used for back contact on silicon solar cells. A-368 high-conductivity back-surface paste adheres to aluminum. All are metallization pastes for photovoltaic cell manufacturing.
Giga Solar Materials Corp., http://www.gigasolar.com.tw/english.asp
ITM Marketing, www.itmconsulting.org
S3X58-M650 solder paste is an ICT testable, halogen-free SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.
S3X70-M407 Pb-free no-clean solder paste for ultra-fine-pitch applications uses a Type 5 powder; has been formulated for 0.2 mm pitch (µBGA) devices and 01005 components. Is said to wet in air environments and is low voiding.
Koki Co. Ltd., www.ko-ki.co.jp
GoWave 1030 wave soldering system is for low-volume production for both leaded and Pb-free applications. Is for soldering small- or medium-sizes batches. Now features a longer reflection tunnel over both the preheat area and the solder pot. Has been redesigned as one unit. Features a new spray flux nozzle with HVLP technology. Has a PCS 707 touchscreen controller and USB interface. Service points for the fluxer and compressed air are now located directly at the inlet section of the machine. Features a new switch cabinet and updated pump motor, as well as a redesigned exhaust area and conveyor.
Seho Systems, www.sehona.com