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Link conveyors for SPI NG/good buffer are designed to stack NG PCBs and transfer good PCBs to the next process using FIFO. Features include PCB shock-free and noncontact power transmission. Has RS-232C interface with SPI and NG PCB anti-touch verification. Is said to provide increased line efficiency and requires minimal space. No need to filter NG PCBs, and SPI operates normally, even during NG PCB verification. AOI NG Buffer stacks NG PCBs and pushes good PCBs to the next AOI inspection process. Features a PCB shock-free and noncontact power transmission. Both systems feature a SMEMA interface, a slim, round design, adjustable stacking, a LED tower light and touch-screen operation.
 
Young Jin/Seika Machinery Inc., www.seikausa.com

 

Falcon 3-axis non-contact video measuring system is said to be suitable for multi-user shop-floor use and advanced manufacturing inspection applications. Employs high-resolution indexed zoom optics (up to 100x magnification), with an indexed camera iris control, increasing accuracy and repeatability of Z-axis results. Incorporates controllable quadrant LED illumination and motorized Z-axis control. Measuring stages provide a measurement capacity of up to 150 x 150 x 115 mm (X, Y, Z) and include factory-completed NLEC calibration as standard.

Vision, Engineering, www.visioneng.us

Parylene Conformal Coating Machine 1092 uses vapor phase to transform coatings from solids. Is horizontal, stainless steel, 8' long x 30" wide. Requires electrical power and a vent connection. Pumping section consists of cold trap and pump; separate controls for temperature and vacuum sensor.
 
Paratronix, www.paratronix.com

 

The FH family of flexible circuit connectors come in different configurations with contact pitches ranging from 0.3 to 1 mm. Are for flexible printed circuit and flat flex cable-type connections. Certain models feature side-retention tabs. Includes: 

FH12 – ZIF connector; 0.5 mm and 1 mm pitch; top or bottom contact points; horizontal and vertical mounting; front flip lock actuator; FPC thickness 0.18 or 0.3 mm; connector height 2, 2.4, 4.85 mm (vertical); contact positions from 6-60;

FH19C/19SC – ZIF connector; 0.5 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm (FH19C), 0.3 mm (FH19SC); connector height 0.9 mm; contact positions from 4-50;

FH23 – LIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.25 mm; contact positions from 15-71;

FH26 – ZIF connector; 0.3 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1 mm; contact positions from 13-71;

FH27 – ZIF connector; 0.4 mm pitch; bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.2 mm; connector height 1.2 mm; contact positions from 10-60;

FH28 – ZIF connector; 0.5 mm bottom contact point; horizontal mounting; front flip lock actuator; FPC thickness 0.3 mm; connector height 2.55 mm; contact positions from 20-80;

FH34S – ZIF connector; 0.5 mm pitch; top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.3 mm; connector height 1 mm; contact positions from 4-34;

FH35 – ZIF connector; 0.3 mm top contact point; horizontal mounting; back flip lock actuator; FPC thickness 0.2 mm; connector height 0.9 mm; contact positions 19, 25, 33, 35, 45 and 51.

Hirose Electric Co. Ltd., www.hiroseusa.com  

 

Alpha CVP-520 solder paste is a Pb-free, no-clean, zero-halogen paste designed for pin-in-through-hole assembly of temperature-sensitive components. Reportedly reflows at peak temperatures of 155° to 190°C. Is said to provide fine feature printing on 0.30 mm circles at speeds up to 100 mm/sec., and in-circuit pin test yield. 

Cookson Electronics, www.alpha.cooksonelectronics.com  

Hirox's MX-BGAZ II Lens is said to perform easy, accurate BGA exterior observation. Allows ball joints to be observed nondestructively. Has 3-D optical rotary ring, including prism tip with lighting and a cushion mechanism to ensure comfortable observation. Helps specify such problems as overheating, oxidation and air foam formation. Inspects upper and lower ball joints Is capable of up to 180X magnification. Features spring-loaded lens tip to protect samples, and configurable and flexible lineup of lenses and peripheral devices.

Hirox/Seika Machinery, Inc., www.seikausa.com

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