SPC+ Software is a yield improvement tool for solder paste printing. Is a high-functionality statistical process control package that can be run on the system or offline. Analyzes images and data to track performance. Defect review, X Bars and S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated with Pareto charts and the ability to drill down on specific data points. Real-time capabilities permit immediate adjustment of solder paste printing parameters. Included free on all new Koh Young equipment.

Koh Young Technology, www.kohyoung.com

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