Leica DVM5000, DVM3000 and DVM2000 digital microscopes display images directly on a high-resolution monitor. Streamlined zoom optics reach difficult-to-access surfaces for nondestructive inspection of large stationary parts. Feature high-quality optics; offer a wide variety of quantitative analysis options, including 2D analysis or 3D surface measurements.

DVM5000 is designed to be brought to the sample. Can convert into a compact, portable system with a few adjustments.

DVM3000 includes zoom optics with encoded magnifications, a high-performance digital camera, integrated metal halide lamp, and standard interfaces for computer and monitor to enable all sample-related data to be sent to the computer for subsequent evaluation.

DVM2000 entry-level microscope is comprised of zoom optics, digital camera, and software, and is based on standard components. Provides a comprehensive range of products and accessories to configure the ideal digital solution for individual needs.

All are equipped with a 2.11 Mp digital camera.

Leica Microsystems, www.leica-microsystems.com

MYPlan v. 4.1 includes a Job Sequence Optimizer. Calculates the best production sequence and changeover strategy for any mix of products and batch sizes. Eliminates unnecessary feeder movements. Automatically calculates an optimized job sequence, using an optimization algorithm that takes both machine speed and feeder loading effort into account. Suitable jobs run together based on part commonality; are placed in family kits. Other jobs will be run separately, with different changeover strategies depending on batch size and priority, including prototypes, large batches, and variants. Is fully integrated with the material handling system MYLabel and the automated storage solution SMD Tower. Provides full visibility of material status and availability.

Mydata Automation, www.mydata.com

TR7007 3D SPI has a reported throughput of 171cm²/sec. at 14 µm resolution and 87cm²/sec. at 10 µm. Implements a fringe pattern technology and a dual lighting system that eliminates shadows and provides defect detection. Uses a linear motor.

Test Research Inc., www.tri.com.tw

IPC J-STD-609A, Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes, presents a marking and labeling system that aids in electronics assembly, rework, repair and recycling; now provides additional codes for more precise specification of certain Pb-free solders.  Provides guidance on marking and labeling of components and PCBs using a range of solder alloys. Enables clear identification of assemblies with lead or Pb-free solder; components that have lead or Pb-free second-level interconnect terminal finishes and materials; base materials used in PCB construction, including halogen-free resin; surface finishes, and conformal coatings. Prescribes maximum component temperature for assembly and rework.

IPC, www.IPC.org