The YTX X3 3-D x-ray inspection system is for PCBs with BGAs and other hidden solder joints. Proprietary imaging technology gathers oblique images to construct a 3-D rendering used to identify solder and component-related defects on both single and double-sided boards. Selectively uses 2-D or 3-D to inspect specific regions on a board. Programming is said to be fast and intuitive, with a typical complete inspection program created in fewer than 30 min. Is suited for in- or offline applications and reportedly offers fast throughput and low false calls. Included are remote programming and real-time SPC software.
Press-Fit, Solderless Interconnect Technology permits assembly of a terminal or electrical lead with a plated through-hole to create a solderless electrical connection. Reportedly is fully tested to meet operating requirements, and has passed standard automotive testing requirements for vibration and for temperatures up to 125°C. Material thicknesses for eye-of-the-needle-based press fit designs are 0.64 and 0.80 mm.
The SM400 Series is designed on the SMART platform. Integrated software features a common operating interface, which is said to provide a stable base platform that is scalable and modular with a space-efficient design. Includes flying-vision centering with individual cameras for each spindle. Identifies component centers during travel from the feeder to the placement location. Head is designed for simultaneous component pickup from the SM feeders. The SM411 Dynamic Chip Shooter is said to place at a rate of 42,000 cph with placements accurate to ±50 µm at 3-sigma (Cpk ≤ 1.0). Dual gantry system includes a dual-lane PCB transport with three on-demand production configurations. The SM421 Advanced Flexible Mounter is reportedly capable of handling up to 72 mm SMT connectors. Is said to reach placement speeds up to 21,000 cph with accuracy of ±30 µm at 3-Sigma (Cpk ≤ 1.0). Has optional external side tray handler and intelligent feeder system.
Progressive Energy Dynamics is based on computational fluid dynamics (CFD) modeling to maximize mechanical, thermal and chemical energy in the various functional stages of a cleaner. PED consists of manifolds, nozzles and pumps said to significantly improve residue removal and conveyor speed. Come on AAT’s inline cleaning systems.
The vision centering system offered on the L-Series Pick-and-Place uses features of Cognex machine vision. Bottom, top, on-the-fly, or fly-by centering options are available. Is said to ensure placement of 0201s, µBGAs, and ultra fine pitch QFPs. Customizable.
The Lynx stereo zoom microscope offers magnification up to 120X and a modular design to permit a range of camera and optical accessories. Now comes with 14-point LED ring light with intensity control. An optional oblique viewing accessory permits components to be viewed from a 34º angle, which can then rotate a full 360º to provide easy inspection all the way around a component.