NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.

FCT Assembly, www.fctassembly.com

NL930PT no-clean, Pb-free, halide-free pin probable solder paste has clear residues and is said to be consistently printable to low surface area ratios. Can be used with SN100C and SAC 305. Has good pin probability, print release to 0.55 SAR when used with Slic Stencil, and wets to all surface finishes, including OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a range of temperatures (65°-85°F) and relative humidity (25-65% RH). Stencil prints at up to 200 mm/sec.; voiding performance exceeds IPC Class III requirements. Features enhanced tack performance and printer open time, as well as shiny solder joints when used with SN100C.

FCT Assembly, www.fctassembly.com

mySelective 6745 selective soldering machine now features a new parallel processing design and dual-soldering nozzles said to nearly double throughput. Setup is quick using the Easyteach2 program.

XPM3 reflow oven now has an AUTOset fast setup feature capable of generating a preliminary reflow profile based on a PCB assembly’s physical characteristics. Also fine-tunes an optimized profile from the preliminary recipe if needed. Reportedly, 85% of the time, modification of the auto-created profile is not necessary.

AUTOset controls ramp-up heating rate, thermal soak, time above liquidus, peak temperature, and total heating time.

Vitronics Soltec, www.vitronics-soltec.com

Spectrum S-920N Series now comes with dual simultaneous jet dispensing, which uses two DispenseJet valves to jet fluid, reportedly reducing dispense time by 50%. Is for CSP underfill and LED silicone encapsulation on multi-up panelized or patterned parts. Ensures flow rates for both DispenseJets deliver the same mass per part. Automatically compensates for fluid viscosity changes over time, as well as batch-to-batch variations to keep the process under machine control. Ensures consistent Takt times. Jets feature flexible spacing options.

Nordson Asymtek, www.nordsonasymtek.com