The 8th Generation model 2800 manual universal programming system combines the speed of Vector Engine Co-Processor technology with universal device support. Supports microcontrollers, NAND flash, NOR flash, serial flash, managed NAND flash, E/EPROM, flash EPROM and other technologies with densities up to an 8 Eb theoretical limit. Supports devices with voltage down to 0.7 (Vdd). Accelerates waveforms during the programming cycle. Has the capability to program with one, two, three or four socket cards. Offers a single socket card purchase for first article qualification.

BPM Microsystems, www.bpmmicro.com

Tridak Model 475 Series diaphragm valves are designed to be used with low-to-medium viscosity fluids. Prevent fluid contact with the actuating components; reportedly ideal for reactive fluids such as cyanoacrylates and solvent-based adhesives and coatings. Offer stroke adjustment to precisely dial-in desired shot volume. Available in three configurations: Standard Model 475 dispensing valve features an UHMW polyethylene diaphragm, acetyl copolymer fluid body and hard-coated aluminum air cylinder body; Model 475-T features a Teflon diaphragm and fluid body with a hard-coated aluminum air cylinder body; Model 475-SA incorporates an UHMW polyethylene diaphragm, passivated stainless steel fluid body and hard-coated aluminum air cylinder body.

Tridak, www.tridak.com

The Razor Beam 0.0315" (0.8 mm) pitch high-speed/high-density strip comes in right angle and vertical orientations for parallel, perpendicular, and coplanar applications. Is designed to save PCB real estate on X, Y, and Z axes. Contacts are reportedly ideal for rugged applications with undercut retention notches that increase withdrawal force and produce an audible click when the contacts engage. Have 20 to 50 contacts per row and a choice of lead styles. Available in heights from 6 mm to 12 mm. Is RoHS-compliant and Pb-free solderable.

Samtec, www.samtec.com

The Worldwide IC Packaging Market, 2010 Edition offers an in-depth look at the worldwide integrated circuit packaging market. Provides forecasts of individual IC device markets, for units, revenue and ASP from 2008 through 2014. Forecasts package solutions for each of these markets, broken into I/O ranges. An overall worldwide forecast of IC packages, divided into 12 different package families, plus bare die solutions, is also provided.

Major package families include:

• Dual in-line package (DIP)

• Small outline transistor (SOT)

• Small outline (SO)

• Thin small outline package (TSOP)

• Dual flat pack no lead (DFN)

• Chip carrier (CC)

• Quad flat pack (QFP)

• Quad flat pack no lead (QFN)

• Pin grid array (PGA)

• Ball grid array (BGA)

• Fine-pitched ball grid array (FBGA)

• Wafer-level package (WLP)

Unit forecasts for die mounted using direct chip attach methods are offered. CA methods include chip on board (COB), flip chip on board (FCOB), chip on glass (COG), flip chip on glass (FCOG), and tape automated bonding (TAB)/tape carrier package (TCP).

Packaging revenue is generated by multiplying worldwide units with pricing information supplied by the contractor IC package assemblers.

Supplies contract IC packaging market forecast, with units and revenue analyzed by package family. Forecasts are computed by compiling information obtained from each individual contract assembly company. Pricing information is provided by I/O count and price per I/O, and when multiplied by units, yields revenue. Profiles of individual contract IC package assemblers are also provided, as is commentary on the state of the industry.

New Venture Research, www.newventureresearch.com