Circuits Assembly Online Magazine - New Products

New Products

Mydata Midas replacement nozzles reportedly are direct replacements for OEM nozzles. Are said to be compatible with TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19, and MY100 (SX/DX). Tool range includes the following nozzle types for fine-pitch components: C14, A12, A13, A14S, B12, A23, A24, and C23. Special Midas nozzles include spring suspended tools (A23S, A24S, C23S), MELF tools (A34, B34, B24, B23, C24), flat pipe tools (blade), multi-port tools, ESD ceramic tools, micro thin tools and gripper tools. Cover QFPs to BGAs to 01005s.

Count On Tools Inc., www.cotinc.com

LFB-1000 flip-chip bonder handles large-scale ICs. Capabilities include NCP, chip-on-chip and copper pillar processing.

Shinkawa, www.shinkawa.com

Siplace CA combines die placement from wafers with classic SMT placement technology. Reportedly eliminates special die bonding processes. Processes flip-chips from wafers at high speeds together with passive components from reels. Is based on Siplace X series, with additional wafer systems as feeders. Features include flip unit, special vision systems, and linear flux dip unit. Each Speedstar CP 20 head is able to place up to 9,000 flip-chips or 6,000 die-attach components per hr. in sizes ranging from 0.8 to 18.7 mm with an accuracy of ±10 µm. Can handle different wafers, which are replaced automatically. Punch-out speed is programmable. Requires only one pass through the oven.

Siemens, www.siplace.com

System 16.350, a derivative of 28.400, is a mid-volume wave solder machine. Is 167.5 cm long, and is dual wave, including a titanium, 350 mm wide automatic finger conveyor with built-in finger cleaner. Other features are convection pre-heat, an adjustable spray fluxer and touch-screen control. Requires less solder – 200 Kg – and comes with a low solder warning. Processing temperatures can be set to Pb-free or SnPb requirements to 300ºC.

Manncorp, www.manncorp.com

Mydata Hydra replacement nozzles and consumables are direct replacements for OEM nozzles. Tool range includes H01 (white), H02 (yellow), H03 (red), H04 (blue), H05 (brown), and H06 (green). Covers all components from ultra-small 0201 chips to midsize ICs, as well as QFPs and BGAs. Uses impact-resistant plastic. Available in standard packs of eight or individually. Each tool is marked with a colored imprint, including the nozzle type.

Count On Tools Inc., www.cotinc.com

KISS-Ware 2.0 software and programming tools imports PCB assembly data from a variety of sources; assists programmer in development of a soldering program to drive KISS selective soldering systems. Uses one or more inputs, including Gerber, DXF, digital or scanned board images, to generate PCB dimensions and display X/Y data points that will become the fluxing and soldering targets. Enables program editing on the PCB image. Automatically generates machine commands required for processing the job. GUI highlights path identifying everything that has been programmed. Can highlight desired items to be edited. Typical programming time reportedly 5 min. Other command features include editing on the actual assembly image, step-by-step prompts, and global edits.

ACE Production Technologies Inc., www.ace-protech.com