Test interface simulation optimizes test interfaces. Signal integrity simulation shows test interface performance. Provides PCB layouts and ensures optimum overall test interfaces. Dedicated simulations may be applied. Verification simulation is a post-layout solution that uses a library of previously simulated models to determine whether an interface meets bandwidth requirements. A limited amount of optimization that compares the PCB material and contactor type also can be incorporated. Interface features can be customized, such as component footprints, contactors and trace topology. Optimization simulation is a 3-D electromagnetic system-level method of ensuring the test interface works the first time.

Multitest, www.multitest.com

Atron AC 207 surfactant PCB cleaner reportedly has a bath life three to 10 times longer than that of traditional surfactants. Offers cleaning results in high and medium pressure inline and batch cleaning processes at low concentrations and temperatures. Removes a variety of Pb-free and eutectic flux residues and unsoldered solder pastes.

Zestron, www.zestron.com

APT-9411 flying probe tester uses four high-speed, independently moving probes, thus eliminating bed-of-nails fixtures. Positioning resolution on x and y axes has been enhanced to 1.25 μm. Flying height has been increased to 40 mm. Comes with four moving probes, two IC opens on the top side, and one camera for vision alignment/inspection. TOS-5 upgrade provides second top-side camera with wider viewing angle, permitting faster visual inspection over a greater area. Standard system inspects individual components at approximately three images per second; TOS-5 option inspects groups of components at same speed. Can be connected to boundary scan and extra power supplies and instruments for digital or limited functional testing.

Takaya, www.takaya.co.jp

F08 Poly-form flexible preform adhesive meets IEC 61249-2-21. Supports efforts to reduce chlorine and bromine levels in component assemblies. Halogen-free adhesives are designed for bonding metals, plastics and glass. Copolymer prevents drips and dispensing inconsistencies. Adhesive placement is consistent. Facilitates manual and automated handling. Can be pre-shaped in multiform configurations to accommodate a broad range of applications.

Multi-Seal, www.multi-seals.com