OM thermal stress system offers assembly reflow simulation and thermal cycling and convection reflow simulation per IPC-TM-650, Method 2.6.27. Is built on air‐to-air thermal shock methodology, air-to-air thermal cycling from room temperature to +230°C. Is able to test 12 HATS, 24 IPC-2221B D-type, 12 IST or custom-designed coupon configurations. Includes precision data acquisition, one reading per net every sec., automatic data analysis and report generation.

Conductor Analysis Technologies, www.cat-test.info

TAGS: electronics assembly, convectio reflow, test

Have you registered for PCB West, the Silicon Valley's largest printed circuit board trade show? Sept. 24-26, at the Santa Clara Convention Center. www.pcbwest.com

High Output series dispensing nozzle has the same external dimensions and orifice size as the standard series nozzle. Internal material path is designed with minimal flow restriction to provide high throughput. Has a low air pressure requirement and works well in the manual tip cutting process. Available in packs of 50 or bulk of 1000 pieces.

Techcon Systems, www.techconsystems.com

StripFeeder Modular (.mod) system v. 2 is for loading tape-and-reel components onto compact modules for prototyping and high-mix, low-volume applications. Features a mechanical lock-spring to hold tape in place by the sprocket hole for part registration and repeatable pick-and-place applications. Removable rails accommodate different tape sizes in the same feeder. Adjustable by removing rails and repositioning them on base plate at desired width (4mm pitched hole pattern). Rails align with pin locaters and lock down with magnets.

Count on Tools, www.cotinc.com

FH35C Series 0.3mm pitch (FPC) flexible printed circuit connector supports high-speed transmissions and provides high retention forces. Back flip style actuator utilizes dual-sided FPC and helps to achieve impedance characteristics. Mounted depth 3.2 mm. Bottom-side features fully-enclosed molded structure for added protection to the contacts. Contacts have additional nickel barrier to prevent solder wicking. Clearance between contacts and housing designed to prevent capillary migration of flux from SMT leads to contact points. Features rugged actuator that confirms when locking function has been completed. Mounted profile of 0.9mm. Come in 9 to 51 positions (9, 11, 13, 15, 17, 19, 21, 23, 25, 27, 31, 33, 35, 37, 39, 41, 45, 49, 51), with an operating temperature range from –55° to +85°C. Complies with halogen-free requirements and is RoHS compliant.

Hirose Electric, www.hirose.com/us

TAGS: flexible printed circuit connector, Hirose, high-speed

Have you registered for PCB West, the Silicon Valley's largest printed circuit board trade show? Sept. 24-26, at the Santa Clara Convention Center. www.pcbwest.com