Rapid 270 probe tester is fully automated. Is for testing all types of printed circuit boards, including ceramics and embedded passive components.
Seica, www.seica.com
Pilot4DV8 flying probe is reportedly for all technologies and all types of electrical, optical and thermal tests. Probes small SMD chips, such as 03015s; is suitable for prototyping, production, repair and reverse engineering of printed circuit boards.
Seica, www.seica.com
Brilliant B2012 is a no-clean, halide-free, rosin-based solder wire designed for manual and robotic soldering. Is odorless and reportedly shows excellent soldering and wetting performance. Was developed for Pb-free rework and touchup. Is available in alloys SN100C, SAC 305 on request, and SnPb with a standard flux content of 2.2%. Available in diameters from 0.3 to 3.5mm.
SN100C B2012 μ-wire is now also available in 0.15mm and 0.2mm diameters.
Balver Zinn, www.balverzinn.com
Cobar, www.cobar.com
OT2 is a halide- and halogen-free solder paste. Has a rosin-based chemistry; has printing and wetting properties for Pb-free and SnPb. Is designed to achieve printing speeds up to 250mm/s. Solvents and activators used return a large process window for the reflow process.
Balver Zinn, www.balverzinn.com
Cobar, www.cobar.com
Series 6 x-ray inspection system includes hexaglide manipulation for manual and semi-automated inspection. Supports universal sample trays; inspects electronic components (e.g., double-sided printed circuit boards) and complete modules, as well as casting parts and medical implants. Can be equipped with automatic load/unload unit or for CT configuration. Permits flexible movements on all axes based on parallel-kinematic hexapod manipulation unit. Six axes motion unit can be moved via space mouse navigator in vertical and horizontal direction and around 180°. Inspects dimensions up to 400 x 400mm and has an XL configuration for up to 550 x 550mm as an option. Can be equipped with different x-ray tubes up to 160kV. Provides up to four x-ray images per sec. in transmission mode.
MatriX Technologies, www.m-xt.com
TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.
Dow Corning, www.dowcorning.com