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Solderon BP TS 6000 tin-silver plating chemistry is for use in Pb-free solder bump plating applications. Is capable of plating speeds ranging from 2 to 9µm/min. Has an Ag composition. Is reportedly robust for bumping and capping of patterned wafers; is not restricted to specific photoresists. Exhibits with-in die uniformity after reflow of <5%. Is macro- and micro-void free after reflow. Is electrolytically and thermally stable. Offers electrolytic bathlife of >100 Ah/L and a ≥6-mo. pot life; is compatible with inline metrology processes.

Dow Electronic Materials, www.dowelectronicmaterials.com

LV1000 low-voiding flux coating is for solder preforms. Is halide-free and is reportedly suited for assembly processes in which components don’t allow for proper outgassing of volatized flux. Provides a clear coating; doesn’t clog pick-and-place equipment. Has weight percentage as low as 0.5%. Is applied to the outside of the preform where flux is required.

Indium Corp., www.indium.com

EVS 500 dross recovery machine dispenses with air-driven pistons and inverts solder/dross separation pot. Adds 180° rotating facility. No teeth are used to separate solder/dross. Is fully automatic. Offers same safeties and locking systems of EVS 8K/10K models. ISO 14001 compatible. Can help reduce dedrossing time by 75% and waste dross off-site by up to 85%.
   
EVS International, www.solderrecovery.com

Medalist i3070 series 5i inline in-circuit tester has a compact chassis and uses 33% less floor space than conventional 3070 systems. Integrates into high-volume production lines. Designed to SMEMA specifications. Short-wire fixturing technology ensures transportability, repeatability and stability of tests. Ergonomic design for easy fixtures changes and routine maintenance. Includes ICT technologies such as Agilent Cover-Extend Technology and a comprehensive suite of boundary-scan technologies. Forward compatibility of standard test programs for ease of switching from offline to inline testing.

Agilent Technologies, www.agilent.com/find/i3070inline_video

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FPC (Fluid Pressure Control) dispensing system reportedly ensures a consistent supply of fluid to the pump regardless of reservoir size or fluid level. Is an upgrade to GPD Max and DS series dispensers; can be added to new system configurations. Comes as a standalone controller and hardware set. Is compatible with auger, needle, pinch tube and jetting pumps.

GPD, www.gpd-global.com

Rapid 270 probe tester is fully automated. Is for testing all types of printed circuit boards, including ceramics and embedded passive components.

Seica, www.seica.com

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