Fineplacer pico ma is for bonding anisotropic conductive film (ACF). Achieves applied bonding forces of up to 700 N, for coherent, durable bonds between the chip and ACF. Features a new multi-chip transfer station, which permits up to four components to be placed simultaneously and bonded with defined distances. Precision z-hub positioning table achieves 5-micron placement accuracy. Places component sizes from 0.125 x 0.125mm to 40 x 40mm and the shifting optics enable alignment of long chip edges. Supports wafer or substrate sizes up to 8". Suited for high-mix, low-volume applications.

FineTech, www.finetechusa.com

TAGS: FineTech, ACF, anisotropic conductive film, component bonding

Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.

Henkel, www.henkel.com/electronics

Pilot 4D flying probe testing line includes V8, M4, L4 and H4 testers. Are suitable to test miniaturized circuits with high component density. Have VIVA 3.0 software and new measurement resources deployed on the probes. Provide electrical and thermal test capabilities and onboard digital programming of complex components. Optical inspection performances enable non-invasive tests for capacitor polarity, as well as LED characterization and verification compliant with the automotive industry. Can be equipped with both single and multiple rack loading/downloading modules.

Seica S.p.A., www.seica.com

CA-195 die attach adhesive is for attaching LED and other small semiconductor die to silver and copper lead frames. Is thermally and electrically conductive, and its glass transition temperature (Tg) facilitates wire bonding to small die. Has low extractable ionics and high adhesion to silver and copper lead frames. Has a dispense open time greater than 24 hr.; maintains optimized rheology for pin transfer or needle dispensing.

Engineered Material Systems, www.emsadhesives.com