Vigon RC 303 is a water-based cleaning agent developed for the removal of baked-on fluxes in reflow ovens and wave solder systems.  Removes re-condensed fluxes and emissions from condensation traps and heat exchangers. Does not have a flashpoint; can be directly applied to warm surfaces and safely operated in wave solder systems. Is available in a 1L spray bottle, as well as 5, 25 and 200L containers.

Zestron, www.zestron.com

Spectrum II now comes with optional Programmable Tilt + Rotate 5-Axis Fluid Dispenser enables the jet to dispense using five axes of automated control instead of three axes. Additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages. Dispenses underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages. Determines height of die stack’s top layer and dispenses fluid along all four sides of the stack just below the top surface, so that sufficient fluid reaches the top of the stack without overflowing over the top. Fluidmove software provides automatic actuation of tilt and rotation functions during production. Dispenses up to ±30° with 1° resolution in either X or Y axis in tilt mode.

Nordson Asymtek, www.nordsonasymtek.com/tilt

N100 PCB Nibbler is for singulating tab routed printed circuit boards. Tabs are cut by placing them under a blade and stepping on a foot pedal. 100 Psi factory air is needed. Excess material from the tab is stored inside a compartment of the tool and can be removed. Blades come in a variety of tab sizes and routing thicknesses. Standard blade thicknesses are 0.062", 0.093" and 0.120". Custom sizes can be requested. For low- to medium-volume production quantities.

FKN Systek, www.fknsystek.com

Fineplacer Sigma semiautomated die bonder is for large die up to 100mm, combined with a working area of 450 x 300high-density array applications and high bond force (up to 1000N) requirements. Handles a wide variety of wafer-level packaging (FOWLP, W2W, C2W) with high bump count used to assemble MEMS/MOEMS, IR/ image sensors, focal plane arrays, and high power device packaging, including assembly of 2.5D and 3D IC packages. Also can pick up from and bond to 300mm wafers. Vision alignment system provides high resolution at all magnification levels and real-time optimized camera images. Touch screen magnifiers allow zoomed images anywhere in the field of view. Two high definition cameras and specially developed optics ensure that the cameras' full resolution potential is tapped. Features pattern recognition.

Finetech USA, www.finetechusa.com