Circuits Assembly Online Magazine - Features

Martin MiniOven 05 BGA/CSP reballing and QFN prebumping system provides enhanced process capability with updated firmware and increased control and temperature stability. Hybrid heating technology heats electronic components similar to a standard reflow oven. A 4-button front display enables fast setup and management of multiple user-defined reballing and prebumping profiles. Profiles are generated using auto profile software and external thermocouple for real-time product temperature feedback. Easybeam Windows-based software enables profile management and backup. Supports inert atmospheres such as nitrogen and uses a gas distribution system.

Finetech, www.finetechusa.com

Gap Pad EMI 1.0 low stress thermal interface material unites thermal conductivity with EMI absorption capabilities. Offers heat and electromagnetic energy control. Has thermal conductivity of 1W/m-K and EMI absorption for frequencies above 1GHz. Thermal conductivity is enhanced by natural tack on one side. Has ability to conform to various topographies. Reduces in-field failures caused by solder joint stress and fractures. Comes in sheet and die-cut formats.

Henkel, www.henkel.com/electronics

Malcom VDM-2 video capture system is used in conjunction with Malcom reflow simulators, capturing video of the simulated reflow process. Includes video mixer that overlays the temp./time/profile data over the video. Receives real-time, temperature, wettability, profile and other data. Data is overlaid onto the video feeds taken by the video camera(s) in real-time. Built-in scale function measures displayed object. Up to two CCD cameras can be connected; displays up to two video feeds simultaneously.

Seika Machinery, www.seikausa.com

FreeSight optical inspection systems feature 500mm working distance with high camera mounting. Models include M20 HD 720p 60fps with high-def 720p inspection camera with 20x optical zoom and swift auto focus; M20 Full HD with 60fps video and 30x zoom, reportedly ideal for all inspection, assembly and repair work. Has 350 to 500mm working distance range and clear examination of objects in 1080p full HD. Offers 550mm FoV; W30 Full HD is a 1080p inspection system with 30x optical zoom and swift auto-focus. All can be configured with an array of lenses, illuminations, x-y or tilt-tables, USB3.0 video streaming with software and full-HD still image capture on external SD-card.

Optilia, www.optilia.eu

LumenX programmer is capable of programming speeds up to 80 MB/sec. and download speeds of 25MB/sec. Offers management and security capabilities, and is said to eliminate security risks associated with duplication process. Software suite ensures data integrity from job creation through production. Includes comprehensive suite of traceability software applications along with fiber laser marking and 3D coplanarity component inspection. Comes on PSV7000 automated system and manual configurations. Supports eight sockets per programmer, with up to 14 in the PSV7000. Supports latest eMMC 4.41 to 5.1 devices

Data I/O, www.dataio.com/LumenX

EP3RR-80 one-component epoxy has a moderate viscosity, good flow properties and an unlimited working life at ambient temperatures. Additionally, this system can be stored at 40-50°F and does not require freezing. For bonding, sealing, potting and encapsulation applications, including flip chips. Is said to cure in 45 to 50 min. at 80°C (175°F), or in 25 to 30 min. at 250°F. Low exotherm while curing enables cure in thicker sections up to and beyond a 0.5" deep. Dimensionally stable compound forms high strength bonds to metals, composites, ceramics, glass and many plastics. Thermal conductivity of 5 to 6 BTU•in/(ft²•hr•°F) [0.72-0.87 W/(m•K)] at 75°F. Service operating temperature range is -100°F to +350°F. Comes in syringes and standard containers ranging from ½ pints to gallons.

Master Bond, masterbond.com/industries/underfill-encapsulants