VERSAMag high-magnification HD inspection system has a multi-axis, high-res camera that tilts and rotates for multiple angle inspection with an adjustable Z-height arm. Has magnification up to 96x and includes real-time video inspection, flexible working heights and intuitive controls. Is ergonomically designed and has measurement and annotation capabilities when paired with FSInspection software. FSInspection software enables operator to provide inspection, documentation and reporting. Operator can capture, annotate, store and share images.
FSInspection, www.fsinspection.com
PICO Toµch controller reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz maximum bursts. Features intuitive touch screen interface for precise control of the valve. Can set precise operating parameters, such as ramp open and close and stroke control. Pulse time can be adjusted in increments as small as 0.01ms. Better slope control delivers more repeatable deposits, while preventing turbulence and air bubbles from entering the fluid.
Nordson EFD, www.nordsonefd.com
PICO Pµlse non-contact jet valve reportedly helps dispense exact, repeatable micro-deposits as small as 0.5nL at up to 500Hz continuous, with 1500Hz max. bursts. Can jet low- to high-viscosity fluids onto any surface, including uneven and tough-to-reach substrates. Has exchangeable parts; adaptable to a range of applications. Tool-free latch mechanism allows for easy removal of the fluid body.
Nordson EFD, www.nordsonefd.com
Disposable material path TS5624DMP diaphragm valve reportedly enables difficult fluids and pre-mixed two-part epoxies to be dispensed without frequent cleaning. Wetted area can be replaced in seconds, while the valve stays on the production line. Wetted parts are manufactured from black Polyethylene to prevent moisture and UV light from coming into contact with the dispense fluids. Dispenses low to medium viscosity fluids over a range of shot and bead sizes, down to a fraction of a µl. Has internal spring return; valves adaptable for use with Techcon Systems controllers. Seal-less valve design offers moisture-sensitive resistance. Diaphragm creates a barrier between the wetted parts and the air cylinder. Valve comes standard with a mounting bracket kit, valve air hose, luer lock fluid line, sample packet of DMP inserts and a dispensing tip selection pack.
Techcon Systems, www.techconsystems.com
StratoSphere Series plasma treatment equipment for wafer-level packaging and 3D packaging can now be configured in two, four or six chamber configurations for increased throughput and flexibility. Provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out. Handles semiconductor wafers up to 300mm (12") in diameter and supports automated handling and processing of round or square wafers. Processes thin wafers with or without a carrier, depending upon wafer thickness.
Nordson March, nordson.com
Vault Tooling Part Holder is available in a variety of standard sizes, pin lengths and densities; also can be configured for most applications and machines. Can be used in applications where the reduction of custom tooling, fixtures, molds or jigs is desired. Technology uses a high-density array of pins that automatically conform to the shape of any part. Once locked, it creates a “nest” to hold the part during the desired process. After completion, the tool is reset. Can be used on bench-tops, robots or integrated into machines or work cells.
Production Solutions, www.production-solutions.com
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