JX-350 is a long board SMT placement machine. Is the successor to LED dedicated mounter JX-300LED. Reportedly improves the placement ability of diffusion lenses for LED production. Has reduced weight of beam and revised head drive control; placement speed increased 18% to 32,000cph. Has the option of a newly developed screw type nozzle; can place six pieces of large components up to 25mm diameter or diffusion lenses simultaneously. Screw type nozzle performs pick, recognition and placement in one pass for the six nozzles. Placement range is a max. 650mm in 1 clamp and 1,200mm in 2 clamps. Can handle up to 1,500mm boards. Can select either electric or mechanical feeder for supply method. Matrix Tray Server TR5S is available as an option.
Juki, www.juki.co.jp/smt_e/index.html
Precision-V no-clean flux remover is nonflammable and non-ozone depleting. Works on no-clean, halide-free, rosin, and aqueous OA fluxes. Has low toxicity.
Techspray, www.techspray.com
PF606-P26 no-clean, halogen-free solder paste is said to prevent BGA non-wet opens and head-on-pillow defects. Is printable, wets and solders well even if BGA components are warped.
Shenmao, www.shenmao.com
EP21NDCL two-component epoxy cures optically clear in thin sections. Has a one-to-one mix ratio by weight or volume. Ratio can be adjusted. Cures at room temp. or more quickly at elevated temp. Upon curing, has durable bonds with high tensile lap shear, tensile and compressive strength of 2,600-2,800 psi, 6,500-7,500 psi and 12,000-13,000 psi, respectively. Volume resistivity greater than 1014 ohm-cm. Resists water, oils, fuels, acids, bases and salts. Withstands thermal cycling over a temp. range of -60° to +250°F. Shelf life of a year at 75°F in original, unopened containers. Comes in container kits ranging from 0.5 pint to 5 gal.
Master Bond, www.masterbond.com
XF-731 (1 mil) and XF-732 (2 mil) label materials use a durable top coat chemistry that reportedly is resistant to harsh fluxes. Labels resist softening at elevated temperatures, do not yellow, and exhibit excellent abrasion resistance. Are thermal transfer printable, semi-gloss white polyimide label materials that use acrylic adhesive systems. Are designed to provide barcode tracking of printed circuit boards and electronic components.
Polyonics, www.polyonics.com
RW1210 rework system contains selectable operating modes that fully automate removal, placement, and soldering sequences. Includes enlarged board holder to handle printed circuit boards up to 430mm x 360mm. Comes standard with a 1.3 million pixel, split-vision CCD camera and a 15” 1080p high-res display. Joystick-controlled zoom with 230x magnification and high-brightness LED lighting provide superimposed views of component leads and PCB solder pads for alignment using ultra-fine X, Y, and Θ axis µm. Provides ±0.01mm placement accuracy for 0.3mm lead pitch µBGAs and delicate QFPs. Includes five hot air nozzles for components from 2 x 2mm to 55 x 55mm. Has 1200W upper and bottom heaters; 2700W, rapid IR underheater heats bottom surface of the PCB.
Manncorp, www.manncorp.com