The time is now for PCBs in DC.
Fill the Void III
In the third of a series of studies, several new variables were tested and compared to previous data on voiding. This round used a new board design that includes two sizes of QFNs, BGAs and LGAs susceptible to voiding, and tested multiple powder sizes.
by Tony Lentz
The Ongoing Convergence of Gaming Devices
Cost, power, bandwidth and form factor of these mobile devices continue to be driving factors for acceleration of integration of silicon and system capabilities into single package or single die.
by Kartik Ananth
Microsoft Xbox One X Teardown
A custom chip built on the AMD platform powers the popular video game console.
by Mike Buetow