The 6000 Plus Series instruments can perform five 5 major electrical safety tests (AC Hipot, DC Hipot, Insulation Resistance, Ground Bond, Open/Short) with Twin-Port technology for simultaneous hipot and ground bond testing. The Guardian 6100 Plus also performs leakage current and functional run tests.

Automate the production line with CaptivATE Software; has a global database to archive data and print test reports on demand. Filter and plot test data to analyze historical trends. Achieve paperless testing and create electronic signatures.

Features include:

AC Hipot to 5000V; DC Hipot to 6000V

Insulation Resistance to 1000VDC and 50G

Ground Bond to 30A (40A with optional transformer)

Leakage Current & Functional Run Tests

Open/Short Circuit (OSC) Detection Mode

Programmable Trip Current; Ramp & Test Times

Storage & Recall of 100 Setups, 50 Steps each

RS-232 and Remote I/O Interfaces, Standard

IEEE-488 and Printer Interfaces, Optional

Built-in 8-Channel Scanner, Optional

Earth, Enclosure and  Patient Leakage Tests are measured with a simulated impedance of the human body, five different models as specified by the various product standards. The Leakage Current mode has a 20A input current capability and multiple display mode (Voltage, Current, VA).  Likewise, tests performed under normal conditions, reverse power line or fault conditions, open ground and open neutral are implemented automatically, without operator intervention.

To accommodate automated production lines, test sequences can be programmed to “Pause”,  “Continue on Fail” or “Fail Retest.”  Test results are indicated on the large front panel LCD display during test and an overall go/no-go indication is provided based on programmed limits.  6000 Plus offers password protected front panel lockout.

QuadTech, quadtech.com/6000Plus

IMS’ family of partial wrap termination resistors offers an exposed solder fillet to facilitate visual inspection of the termination joint of the flip-chip resistor.

The flip-chip resistor delivers high frequency performance to 40 GHz, from 10 Ohms to 2 KOhms. The partial wrap around termination is available in Platinum Silver, or with a SAC solder coating.

Resistors are great for high frequency radio communications, microwave and radar applications. Offer stable ohmic value well into millimeter wave frequencies. Other applications include medical devices, test instrumentation and sensors.

Available in the following package sizes: 0302, 0402, 0502, 0603 and 0805.

IMS; sales@ims-resistors.com

Version 4.2.1 of the boundary scan environment System Cascon includes integrated support for the hardware platform Scanflex, as well as new ways of handling test vectors.

In addition to the Scanflex interface, numerous software features have been implemented, including support of eight independent, parallel TAPs and a hardware configuration tool with AutoDetect functionality to automatically recognize and manage all connected hardware – SFX-Controller, SFX-Transceiver and TAP Interface Cards (TIC), and SFX I/O Modules. Supports other Scanflex features, such as the controller architecture Space II, the Fastscale principle for controller upgrades on-the-fly, the improved ADYCS II for compensation of signal propagation delay independently for each TAP, and Hyscan technology for separated but synchronized handling of parallel and serial vectors.

The project database can handle level groups for nets and pins. Level group assignments allow external I/O channels to be set up automatically with appropriate parameters to match the voltage family of pins on the UUT they are connected to.

Improvements include new commands for the integrated boundary scan programming language Caslan, capability to import IBIS models into the graphical Device Library and new functions in the Component Explorer for intelligent UUT CAD data management.

Backwards compatible to earlier versions, supports VXI, PXI, PCI, USB, GPIB, Parallel Port, RS232, and Fast Ethernet boundary scan controllers.

GÖPEL electronic GmbH, www.goepel.com

AL Series optical inspection and defect review system delivers wafer edge and bevel inspection.  Full bevel inspection allows user to see the top, side and bottom of the wafer from various angles using  continuous angle adjustment.  Detects particles, pits and residues that lead to hot spots on the front side, chips, cracks and scratches that cause wafer breakage, and edge bead removal issues harm the individual wafer and can result in equipment and wafer cross contamination.  Defect information and images are stored in a common defect format for tracking and yield analysis.

"A 300-mm wafer has 942 mm of edge, giving you nearly one meter of edge die on every wafer," said Greg Baker, COO. "Edge die yield remains one of the big challenges in IC manufacturing with a variety of edge defects contributing to loss. If edge defects are reduced, wafer yield improves. Olympus's new edge and bevel inspection technology enables semiconductor manufacturers to detect these defects early in the manufacturing process and track them through the process."

Perform a range of inspection and defect review tasks, including macro and micro inspection, automated image capture, operator or automated defect review, and automated defect classification.

Include a variety of visible light imaging methods using Universal Infinity Systems (UIS) corrected optics. Can integrate 248-nm Deep-UV Air Gap optics for optical resolution of 80 nm.   

Available with GEM and GEM300 factory automation software. A variety of SEMI compliant load ports (FOUP, FOSB, SMIF, open cassette) can be attached in various configurations (front, rear, or side load).

Olympus Integrated Technologies America, olympus-ita.com