The Optoelectronics Division of Bivar Inc. introduces a new surface-mount RGB-based device for optimized control of color and brightness, including a brilliant white, packaged in a low-profile, industry standard PLCC- 4 (plastic leaded chip carrier) device with a 120º viewing angle. Applications include high-contrast video displays (such as LCD monitors, backlighting in automotive dash clusters and exterior automotive lighting), instrument panel backlighting, navigation and switching systems, and medical instrumentation.

Features an internal tri-chip circuit, employing three individually addressable LED die. Lens appearance when off is water clear. Comprised of a single AllnGaP and two InGaN/SIC chip dies, featuring peak wavelengths of 625, 568 and 430 nm respectively. The result is a programmable white or brilliant full color display that can meet specific display needs. Absolute maximum rating of forward current drive is 200mA (Peak If). Other models in the product family include single and bi-color chip available in red, green, blue and yellow, including ultra and HE colors such as 395 UV– 525nm pure green.

The PLCC-4 configuration, including a four-pad metal heat dissipating base, measures 0.075” high, with a footprint of 0.110” x 0.138”.

Bivar Inc., www.bivar.com

BEAVERTON, OR— Tamura H.A. System Inc. will highlight TPD6-25F, a lead-free selective soldering system, in booth 8551 at SEMICON West in July.

The stand-alone system features cost-efficient application, a selective spray fluxer with precision needlepoint and six individual FLIP units ¾ individually programmable on soldering time and soldering height.

Top clearance of parts is 150 mm and maximum bottom clearance is 25 mm. Features a 60 second throughput tact time per board/panel, as well as touch-panel operation with up to 20 PCA memories. The system’s preheater uses solder bath temperature, and the spray fluxer is a precision needle spray nozzle that is position programmable.

Tamura H.A. System Inc., www.tamura-ha.com

Ashburn, VA – Zestron announced that it is fully prepared to meet the hazardous substances (RoHS) and waste disposal (WEEE) guidelines.  For over 15 years, the company has actively avoided the use of any hazardous or dangerous raw materials that might be considered harmful. 

Zestron’s cleaning agents are free of all hazardous materials including lead.  The cleaning media therefore fulfills all environmental requirements and exceeds most workers’ safety standards. 

The company’s cleaning technologies (i.e. MPC Technology) are designed to be used in a closed loop system which enables long bath life and little to no waste water generation.  Therefore, the cleaning agents claim to offer more economically and ecologically sound solutions, especially when compared to traditional surfactant based products.

SYDNEY – Altium Ltd has released Service Pack 4 (SP4) for Altium Designer, a single, unified application that is said to incorporate all the technologies and capabilities necessary for electronic product development. Available as a free download to existing licensed customers, it includes over 100 new features and enhancements.

Document file locking improves collaborative design. Documents opened for editing by one designer can be locked to prevent accidental overwriting by other designers.

A new ‘Archive Project’ command automatically consolidates all project documents within a compressed zip file.

At the PCB level, SP4 introduces real-time, 3-D component clearance checking when placing parts. Designers can define the extent of components in terms of multiple areas, heights and standoffs, creating a complex 3-D ‘envelope’ of the component body. Enhancements to component clearance checking rules allow clearances in all directions to be monitored in real-time during placement.

Schematic editing now includes the automation of common rework operations on schematic designs. New commands include ‘Push Part to Sheet’, that makes it easy to replace a component with a sheet symbol, automatically creating an additional subsheet containing the displaced component and maintain overall connectivity. ‘Rename Child Sheet’ command allows the user to change the filename of a subsheet and optionally update all sheet symbols in the project or workspace.