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Speedline Technologies has released lead-free enhancements for its Electrovert Econopak Gold Wave Soldering Systems.

Designed for medium volume electronics manufacturers, the systems ship lead-free process ready.

The compact wave soldering solution now has UltraFill Nozzles and a Quick Change Solder Pot.

Nozzles are 40% percent wider than the traditional tin/lead nozzle. Their design and placement mean less superheat is required to reflow solder joints in the second wave. Benefits include improved hole fill, bridge defect reduction and reduced dross formation. Available in Melonite Corrosion Resistant Stainless Steel or Titanium material.

An optional Nitrogen shroud encompasses the nozzles in the pot. It allows for air or nitrogen operation and lift design ensures ease of maintenance and dedrossing without change or removal.

Solder pot allows for the easy switch between alloys such as tin/lead and lead-free solder. The unit includes a second solder pot with motors, pumps, flow ducts, nozzle and two trolleys.

The lead-free ready platform can be fitted with many features including nitrogen inerting, convection pre-heating, Rotary chip wave, gas knife de-bridging technolog, and alternate fluxing options. The solder module provides wave dynamics for densely populated circuits, SMT components and difficult-to-solder geometries. Processes boards up to 400 mm with 1.2 m of preheat.

Speedline Technologies, speedlinetech.com

Model 9700 XY Terminal Insertion System features easy setup and alignment, ideal in manufacturing work cell environments for production lines and the demands of contract manufacturers. Said to increase reliability and product yields while modular tooling reduces downtime between terminal changeovers and during preventive maintenance.

Combines Model 9700 insertion machine with a high-speed, servo-driven x, y platform. Is fully automated, versatile and modular. Interchangeable applicator tooling offers several features that improve overall performance. Has computer-programmed self-teach insertion pattern feature, modular toolsets and compact size.

Features a 12 x 12" PC board capacity with dedicated or adjustable board fixturing options. Offers a machine cycle rate of over 5,000 insertions per hour with a compact design.

Zierick Manufacturing Corp., zierick.com

EP45HT MED is a two-component, heat-cured epoxy adhesive. Reportedly durable, tough and resistant to exposure to thermal shock and many chemicals. Can withstand long-term exposure form -80 to 500°F and has a glass transition temperature of >185°C. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is said to be excellent. The cured system works as an electrical insulator.

Specially formulated for use in the assembly of reusable medical devices. Can withstand exposure to repeated cycles of radiation, steam (autoclaving) and chemical sterilants. Meets the biocompatibility requirements of USP Class VI specifications.

Has a 100 to 30 mix ratio by weight and requires a minimum cure temperature of 250°F. Is 100% reactive and does not contain any solvents or diluents. Can be applied by brush, syringe or spatula. Available for purchase in pint, quart, gallon and five gallon container kits.

Master Bond Inc., masterbond.com

Highlighted systems at booth 2C01 include:

Camalot inline liquid dispensing system for low-to-medium production requirements. Ideal for SMT and hybrid applications, including glob top, solder paste, corner bond, gasketing and glue dotting functions. Features fast, accurate dispensing, up to 13,000 dots per hour; reliable construction with welded steel frame and cast aluminum gantry supports; and Camalot pump technology for process control.

Uses lead screws and servo motors (with closed-loop encoders) on all three axes to assure smooth, precise and accurate dispensing with an enhanced GUI.

With a 0.9 x 0.9 m footprint, and dispensing area of 254 x 254 mm. Options include a touch-probe z-axis sensor, hot plate and auto needle calibrator.

MPM AccuFlex stencil printer, for moderate-volume, high-mix printing, combines accuracy and flexibility in a compact footprint. Offers a range of options for future expansion. Designed for production of about 8,000 boards per week with two or more product changeovers per shift, handles boards from 3 x 2" to 23 x 20" and can print 12-mil pitch devices with consistent accuracy.

MPM Gel-Flex Tooling System supports the circuit board during stencil printing. Consists of non-conductive polyurethane elastomer gel enclosed in a durable membrane shell and mounted to a magnetic base. The compressible gel material provides gentle compliance to delicate bottom-side components and leads while providing support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000 and UltraFlex BBP printers.

For local information contact Wei Feng, business manager, China:weifeng@speedlinetech.com.

Speedline Technologies Asia Pte Ltd., speedlinetech.com

The latest upgrade to the VISULA PCB design environment reportedly enables users to integrate with the firm’s high-speed design solution, CR-5000 Lightning. Users can now take advantage of CR-5000 Lightning’s high-speed routing and simulation technology to explore different design scenarios and signal integrity trade-offs.

The upgrade is free of charge for all VISULA and former Hot-Stage customers with a current maintenance agreement and for those existing VISULA users purchasing a new license of CR-5000 Lightning.

Zuken, zuken.com

Zurich, Switzerland -- DEK has developed a high-throughput backside wafer coating process, which is hosted on a mass imaging platform capable of exceeding the +/- 12.5 um total thickness variation (TTV) required by most wafer processing specialists. The process is compatible with underfill or adhesive-type coatings which are normally applied at a nominal 50 m thickness to the backside of semiconductor wafers prior to singulation.

“For any backside wafer coating process, TTV is the critical success factor,” said Clive Ashmore, global applied process engineering group manager. “With this latest application advancement, we are helping semiconductor packaging manufacturers increase throughput and reduce the cost per package by using high accuracy mass imaging.”

According to the company, the use of an optional wafer handler, flexible printing platform and reflow oven achieves more flexibility than dedicated backside coating machines. The system can be re-deployed for other processing requirements.

The backside wafer coating process is compatible with the company’s metal stencil and emulsion screen technologies. Metal stencils enable materials with larger filler particles, such as encapsulation materials, to be applied with a totally smooth surface finish. Mesh stencils allow other materials such as thermoplastic adhesives to be deposited accurately and at high speed. In each case, the capabilities of the machine and stencil technology are key to achieving control over the print thickness and ensuring uniformity at high volumes.

DEK, dek.com