NanoClear stencil treatment is reportedly now 50% stronger. Reduces frequency of underside cleaning. Better performance from stencils with low aperture area ratios. Uses self-assembled monolayers with phosphonates that are compatible with common types of stencil alloys, including stainless steel, electroform, nickel, and e-polished stencils. Monolayers are fewer than 5nm thick and covalently bound to the surface.

Aculon, www.aculon.com

Indium9.91 no-clean solder paste is for package-on-package applications 0.3mm and larger. Rheology optimizes dipping and package retention. Reduces defects due to package warping; provides solderability; has long pot life, and provides consistent solder paste volumes. Can be used with SAC 305 and Sn63 alloys.

Indium, www.indium.com

Aquanox A8820 aqueous stencil cleaner is designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. Removes common solder pastes and fluxes; is compatible with stencil cleaning equipment. No-foaming property is compatible with materials used in electronic assembly manufacturing and cleaning processes. Comes in one, five, and 55 gal. containers.

Kyzen, www.kyzen.com

Konform Ultra fast-dry acrylic conformal coating provides insulation protection against high-voltage arcing and corona shorts. Provides a barrier against humidity, salt, corrosive vapors and fungus for printed circuit board and electronic assemblies. Dries quickly. Meets IPC-CC-830B Class B and sections of MIL-I-46058C, type AR. Contains UV indicator. Is compliant with RoHS and REACH.

Chemtronics, www.chemtronics.com