Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. Fills air gaps between board components and processors. Transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin²/W at 14.5 PSI (1.33°Ccm²/W at 100Kpa). Is a flame retardant TIM available in sheets up to 300mm x 200mm. Can be die-cut or trimmed to fit application specifications.

Fujipoly America Corp., www.fujipoly.com

GF-125 HC/HT five-zone horizontal convection reflow soldering oven has longer conveyor length and two additional zones. Has tunnel length of 56". GF series incorporates Horizontal Convection Heating technology; air is circulated horizontally in one direction above the board and in the opposite direction below the board. Compatible with Pb-free solder.

DDM Novastar, www.ddmnovastar.com

PSV7000 automatically programs up to 2000 devices/hour with tray, tape or tube input. Is capable of handling devices as small as 1.5 x 1.5mm. Cuts changeover times up to 75%. Options include laser marking, 3D co-planarity, serialization and traceability software. Can have up to 96 individual programming sockets installed and supports all device types, including FPGAs, CPLDs, microcontrollers, and flash memories (including eMMC, NAND and NOR devices). 

Data I/O, www.dataio.com/PSV7000

PSV7000 automatically programs up to 2000 devices/hour with tray, tape or tube input. Is capable of handling devices as small as 1.5 x 1.5mm. Cuts changeover times up to 75%. Options include laser marking, 3D co-planarity, serialization and traceability software. Can have up to 96 individual programming sockets installed and supports all device types, including FPGAs, CPLDs, microcontrollers, and flash memories (including eMMC, NAND and NOR devices). 

Data I/O, www.dataio.com/PSV7000