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HSEC8-DP series 0.80mm-pitch socket is a differential pair version of Edge Rate 0.80mm-pitch sockets.

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vVision 2.4 software platform optimizes inspection program creation, especially for new components and special component types, and comprehensive 3D advancements such as 3D solder joint inspection for chips.

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Conductive version of LAS 260 extraction and filtration system is suited for extraction and filtration tasks in processing materials that may generate inflammable or explosive dust/air mixtures.

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XILS600 handler is for multiple stations working in parallel but in a physical serial layout.

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Hawk MV-4000 smart camera reportedly quadruples the processing power of the previous generation and has up to six times the frame rate, achieving real-time trigger response using an FPGA.

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F498 no-clean solder paste has a low melting point and low void rate.

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