Products
eC-reflow-mate v. 4 reflow oven gives an even temperature across the PCB under user control throughout soldering process.
Saki Self-Programming software is for solder paste inspection and automated optical inspection equipment.
HSI1x instrument for Diamondx platform features 32 transmit lanes and 24 receive lanes with up to 12.8 Gbps data rate.
Loctite Ablestik ABP 8068T die attach materials facilitate package-level sintering and address regulatory challenges of high-lead solders, thermal conductivity drawbacks of conventional die attach pastes, and processability shortcomings of traditional sintering products.
Press Releases
- SP Manufacturing Brings World-Class EMS Expertise to MD&M East 2025; Jackson Tan Comments
- Aligned Solutions Announces Leadership Transition: Bryce Timms to Succeed Mike Young in Ohio, Kentucky, Western PA; Jim Rittma Comments
- SASinno Americas Expands Product Portfolio with Private-Labeled Purex Fume Extraction Systems; Mike Young Comments
- DISTRON CORPORATION Celebrates 20-Year Anniversary of Test Engineering Manager Richard Guerin