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Alpha PowerBond solder preforms are for high-temperature, high-reliability, lead-free interconnects for automotive and power semiconductor applications.

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F13 solder wire for automatic soldering machines conforms to J-ST-004 (ROL0).

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iJet table dispenser models 250 and 350 are for SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, and flat panel assembly.

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TVM field of view (FOV) video measurement systems include TVM20 and TVM35, with FOV sizes of 20mm and 35mm, respectively.

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This image comparison app enables comparison of PCB reference images to live or captured sample images of PCBs.

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Gen7 acoustic micro-imaging tool provides greater versatility in transducer movement, faster scanning of samples, and faster processing of data.

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