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WILMINGTON, DE – Cybord, a provider of advanced AI-powered component analytics, has partnered with Fuji America Corporation, a global leader in surface mount technology (SMT) equipment. As part of the agreement, Cybord becomes one of Fuji America’s preferred technology partners, delivering cutting-edge AI solutions to SMT customers.

The collaboration cements Fuji America’s position at the forefront of manufacturing excellence by integrating Cybord’s unique, visual AI solution to provide unprecedented electronic component quality assurance and traceability to its customers across all industries.

With electronic component supply chains in flux and under constant stress, it is increasingly difficult to predict the next disruption. Product recalls in the US, for example, are expected to surge this year, and many will be due to faulty, damaged, or inauthentic electronic components. Electronic component analysis is thus crucial for manufacturers to reduce costly recalls, rework, and scrap, and to ensure product quality for their customers and end-users. The Fuji America-Cybord solution provides the only way to inspect 100% of the components on an assembly line to mitigate against these disruptions.

“This is truly a great and exciting partnership for the SMT industry,” said Hirofumi Yoshimi, president of Fuji America Corporation. “This partnership leads the entire manufacturing level at our customers to the next step. Cybord’s total electrical components quality control system powered by their own developed AI strengthens our well-known equipment quality and reliability even more, and contributes to better than today quality and productivity for our customers production.”

Cybord’s visual AI-powered solution provides real-time inspection of 100% of electronic components during PCBA assembly with 99.9% accuracy, preventing defective, counterfeit or non-compliant parts from being placed on the printed circuit board (PCB). Leveraging its immense database of nearly five billion components, Cybord analyzes components with exceptional precision, enabling manufacturers to vastly limit the scope of recalls, reduce their exposure to supply chain vulnerabilities, and reduce rework and scrap rates – thereby safeguarding both their reputation and profitability.

“We are honored that Fuji America, a world-leading company, has chosen Cybord as a preferred AI technology partner,” said Oshri Cohen, CEO of Cybord. “Utilizing our cutting-edge innovation, Fuji-America sets a new industry standard for quality, reliability, and efficiency in the electronics manufacturing industry. Fuji America’s dedication to ensuring quality aligns perfectly with Cybord’s mission. Together, we’re empowering manufacturers to stay ahead of market demands and enhance end products with the combined strengths of Fuji America’s equipment and Cybord’s revolutionary technology.”

The Fuji America-Cybord partnership is slated to launch in January 2025, ushering in a new era of quality and efficiency for SMT manufacturing across the Americas.

NEW YORK, NY – RENEX, a European leader in advanced electronics manufacturing solutions, is pleased to announce its exclusive distribution agreement with Technica USA, a leading distributor in the United States. Under this partnership, Technica USA will distribute the REECO brand of ESD and cleanroom products in key territories, including California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming, with nonexclusive coverage in Washington and Utah.

Technica USA, established in 1985, is recognized for its expertise in providing advanced equipment and materials to the PCB Fab, Substrate, PCB Assembly, and MEMS markets. Known for delivering comprehensive solutions, Technica USA specializes in sales, installation, service, and inventory management, making it a trusted partner for manufacturers across North America.

Frank Medina, President/CEO of Technica USA, expressed his enthusiasm about the partnership: “We are honored to be chosen as the first distribution partner for RENEX in the United States, representing and supporting the REECO brand of ESD and cleanroom products. These products meet the highest quality standards, and their design reflects a deep understanding of the needs of end-users. The addition of the REECO brand complements our portfolio of best-in-class solutions for our customers.”

“This milestone is the result of over a year of hard work in the North American market. Having Technica USA as our official distributor is not just a partnership – it is a testament to the strength and potential of our business outside the EU,” added Robert Beber, Export Director at RENEX. “Technica’s trust in RENEX and the REECO brand confirms the quality of our products. We are thrilled to join forces at the APEX show to showcase REECO to the North American audience and look forward to expanding our distribution network in other U.S. regions."

Predrag Topić, owner of RENEX, also commented on the significance of the partnership: “This agreement with Technica USA is an important step in strengthening the presence of the REECO brand in the United States. Technica’s professionalism, market expertise, and dedication to customer satisfaction make them an ideal partner. Together, we aim to ensure that the REECO product line exceeds the expectations of industry professionals, delivering reliable solutions tailored to their needs.”

RENEX and Technica USA invite attendees to visit their booths at the upcoming IPC APEX EXPO, taking place March 18-20 in Anaheim, CA. REECO products will be showcased at booth #1629, while Technica USA will be at booth #4110. This collaboration marks a significant step in bringing world-class ESD and cleanroom solutions to U.S. industries.

For more information or for a copy of their product brochure, visit www.renex.pl 

BILLINGSTAD, NORWAY – Kitron has entered into a significant long-term contract for the production and services of advanced optical assemblies tailored for the Unmanned Aerial Vehicle (UAV) and drone market.

The contract is expected to generate revenues exceeding EUR 30 million in 2025.

Production will be carried out at Kitron’s facility in the Czech Republic, leveraging the company’s extensive experience in building complex assemblies.

“We are proud to embark on this long-term collaboration, which strengthens our position in supporting technological advancements in unmanned systems,” says Peter Nilsson, President and CEO of Kitron.

The new contract solidifies Kitron’s role as a key supplier of advanced box-build assemblies that meet stringent size, weight, and power requirements without compromising performance. These assemblies are essential for applications such as security, surveillance and inspection, where high-quality imaging is critical.

DAYTON, OH – Libra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is pleased to announce significant enhancements to its machining capabilities at its corporate headquarters in Dayton, Ohio. These investments further cement Libra Industries' reputation for delivering advanced solutions in semi-cap, aerospace, defense, and medical manufacturing.

The Dayton facility now boasts cutting-edge equipment, including:

  • Kitamura Medcenter 5AX 5-Axis Vertical Machining Center: This high-performance system enables exceptional machining precision and repeatability, producing complex geometries with superior surface finishes. With its high-speed spindle and multi-axis capabilities, the 5AX eliminates secondary operations and reduces production cycle times, ensuring optimal efficiency and quality.
  • Mitsubishi MV1200-S Wire EDM Machines (x2): These machines excel in achieving tight tolerances for intricate features such as thin-wall flexures. The advanced linear shaft motor drive system and next-gen wire threading allow for lights-out operations, faster cutting speeds, and immaculate surface finishes.

“By investing in these state-of-the-art systems, we’re reinforcing our commitment to delivering unmatched precision and reliability to our customers,” said Joe Egbert, VP/General Manager of Libra Industries Dayton facility. “The enhanced machining capabilities at our Dayton facility position us to meet the growing demands of complex, high-precision projects while maintaining the highest quality standards.”

With 45 CNC machines and a robust team of engineering, supply chain, and quality professionals, Libra Industries’ Dayton facility specializes in complex systems integration and advanced robotics assembly. Additionally, its ISO Class 7 cleanroom facilities ensure precision manufacturing for sensitive applications.

For more information about Libra Industries and its expanded capabilities, visit www.libraindustries.com.

DALLAS, TX – StenTech Inc., the leading multinational SMT printing solutions company, is pleased to announce the appointment of Jordan Owens, MBA, CPA, as its new Chief Financial Officer. Jordan commenced his duties at StenTech’s headquarters in Dallas, Texas, and brings with him a wealth of expertise in financial leadership and strategic growth.

Jordan comes to StenTech with extensive experience serving organizations as a strategic finance leader in the areas of Finance, Accounting, Strategic and Tactical Planning, and Commercial and Product. He has a passion for leading growth and transformation focused on financial strategy and execution that delivers results that align and connect teams on driving financial results that support the business strategy. He has led the implementation, development, and improvement of business processes and systems as well as the formation and establishment of new teams and business disciplines. Jordan’s proven track record in these areas will strongly support StenTech’s growth.

"We are thrilled to welcome Jordan to the StenTech team," said StenTech CEO Kevin Keene, "His impressive background and leadership experience make him an excellent fit for our organization as we continue to expand and innovate. Jordan's expertise will be instrumental in achieving financial excellence and advancing our mission of empowering customer by delivering quality products and innovative solutions to leading electronic manufacturers.”

Commenting on his appointment, Jordan said: "I’m grateful to join the StenTech team and help them navigate through growth as it builds upon its continued success as a leader in SMT printing solutions. StenTech’s commitment to quality, innovation, customer success, and problem solving capabilities excite me and complements well with strengths and desires to serve.”

Jordan also holds a MBA from UNC Kenan Flagler and a CPA designation, further underscoring his qualifications to lead StenTech’s financial strategy and operations through its exciting growth and transformation.

CLINTON, NY – Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.

Indium Corporation will showcase the following products:

  • AuLTRA® Precision Die-Attach Preforms offer the NEW Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
    • Highly accurate thickness control
    • Precise edge quality
    • Optimized cleanliness
    • Default waffle pack method
    • Available for gold-based alloys
  • AuLTRA® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA® 75 product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
  • AuLTRA® ThInFORMS are 0.00035"-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS help combat common issues such as shorting and poor thermal transfer.
  • AuLTRA® Fine Ribbon is the company’s Indalloy®182 fine-grade precision ribbon for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.
  • AuLTRA® 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimized to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA® 3.2 delivers superb wetting and low voiding.
  • AuLTRA®5.1 is a no-clean AuSn solder paste, specifically formulated to endure the higher temperatures required by Au-based alloys. Ideal for high-power LED module array assemblies, this formulation provides a broad processing window and consistent print definition, even for ultra-fine pitches. Additionally, AuLTRA® 5.1 excels in wetting performance and void minimization, while meeting rigorous printing and reflow standards.
  • Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #4923 at the show.

 

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