DORNSTADT, GERMANY – The ASYS Group hosted a highly successful Technology Days event from October 23 to 24, 2024, at its headquarters in Dornstadt, Germany. Welcoming a record number of over 350 enthusiastic visitors from industries including Electronics, Life Science, and Energy, the event showcased cutting-edge technologies across 1,000 square meters of exhibition space. From a new software platform to an AI-powered solution, ASYS presented its latest advancements, solidifying its position as a leader in automation and innovation.
A Deeper Dive: Keynotes and Tech Sessions
Under the theme "Ahead of the curve" the two-day event offered four inspiring keynotes and 16 in-depth tech sessions. Kicking off the program, ASYS Group CEO Jürgen Ries shared the company’s vision, driving innovation across all business segments: "I don’t see another company in our industry delivering this level of innovation while making customers feel part of our journey."
Highlights from the event included:
Keynotes: Bridging Innovation and Inspiration
On Day 2, big wave surfer and adventurer Freddy Olander delivered a captivating keynote, drawing parallels between conquering extreme challenges and pushing technological boundaries. His message, "Riding the Wave of Innovation," resonated with the audience, inspiring bold, forward-thinking approaches. Other keynote highlights included:
Tech Sessions: Spotlight on Innovation
The event featured specialized tech sessions of ASYS Group experts, including:
Looking Ahead
ASYS’s Technology Days 2024 not only highlighted its current achievements but also set the stage for future innovation. With a commitment to advancing automation, sustainability, and customer-centric solutions, ASYS is poised to lead the industry into the next era.
CEO Jürgen Ries summed it up best: "Markets are tough, but the potential is immense. It’s our mission to deliver tailored benefits and address future customer needs. - We want to get our customers in prime position to ride the wave that is sweeping through the industry.”
Conclusion
The Technology Days 2024 were a resounding success, blending inspiration, technical innovation, and customer collaboration. As ASYS continues to embrace challenges and opportunities, the industry can look forward to more groundbreaking solutions from this automation pioneer.
TORONTO – Bittele Electronics, a Canadian one-stop PCB manufacturer, is excited to announce the upgrade of its printed circuit board facilities to better serve the rapidly growing artificial intelligence (AI) industry. As AI technology drives innovation across various sectors, Bittele has enhanced its assembly capabilities to accommodate the demand for complex, AI-compatible PCBs. These new capabilities include advanced assembly processes for large BGA, fine-pitch BGA, and the integration of small capacitors and resistors.
"AI technology requires exactness and high quality," said Ben Yang, CEO of Bittele Electronics. "We have completely built our Markham, Ontario-based PCB manufacturing and assembly facility to provide these critical capabilities."
"We have achieved certification for our facilities in accordance with ISO 9001:2015 and ISO13485:2016, as well as IPC-A-610 standards. This guarantees our customers that our AI PCBs are assembled to the highest quality standards. We are equipped to manufacture AI PCBs for medical, military, and other high-reliability applications."
Bittele is a manufacturing specialist in fully automated, touchless, PCB fabrication and assembly with added capabilities for advanced reflow systems that optimize soldering processes for components requiring optimal reliability for advanced AI hardware.
As AI adoption transforms key business sectors such as healthcare, transportation, and consumer electronics, Bittele is dedicated to offer its customers high quality precision manufacturing, reliability, and technology to adapt to the sophisticated specifications of AI-capable electronic hardware.
SANTA CLARA, CA – Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is pleased to announce the appointment of Greg Beck as Director of Sales. With an impressive career spanning more than three decades in business development and high-tech sales, Beck brings a wealth of experience and a proven track record of success to the Absolute EMS team.
Beck has a history of driving substantial revenue growth and securing new business with global brands such as Boeing, Intel, Apple and L’Oréal. Known for his expertise in consultative selling, strategic account management, and closing complex negotiations, he has consistently exceeded sales quotas and earned numerous accolades, including being named to the President’s Circle for five consecutive years. His background includes leadership roles at prominent companies such as Zollner Electronics, Benchmark Electronics, and Ascential Technologies, where he expanded market share and developed high- performing sales teams.
“We are proud to welcome Greg Beck to our leadership team as we continue to experience strong growth and expansion,” said Doug Dow, COO of Absolute EMS. “Greg’s strategic vision and extensive industry experience make him the perfect fit to lead our sales initiatives. His ability to build strong client relationships and drive revenue will be instrumental as we continue to grow and innovate in the electronics manufacturing sector.”
Beck holds a Bachelor of Science in Chemical Engineering from the University of Missouri and has completed advanced training in sales and data analytics. His community involvement includes long-term support for organizations like New Directions for Veterans and the Barbara Sinatra Children's Center.
“I am excited to join Absolute EMS and contribute to its continued success,” said Greg Beck. “The company’s reputation for quality and innovation in electronics manufacturing is second to none, and I look forward to working with the team to drive growth and deliver exceptional solutions to our customers.”
For more information about Absolute EMS, visit www.absolute-ems.com
SEOUL, KOREA – Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024. Our team of experts will be on hand to discuss how our inspection solutions can boost quality and increase yield for advanced and wafer-level packaging. Our team of inspection experts will highlight three different machines: Meister S, Meister D+, and ZenStar.
Meister S
Premium In-line 3D Inspection System for Micro Solder Paste Deposits. The Meister S has been qualified for mass production by major semiconductor foundries and Mini/Micro-LED companies for micro solder inspection with superior full 3D inspection performance. Combining innovative vision algorithms and high-resolution optics, the Meister S goes beyond micro solder paste inspection, but also a proven solution for Flux inspection.
Meister D+
The Meister D+ combines industry-leading Moiré technology and Koh Young’s proprietary new optics to support 3D inspection of highly reflective dies, a long-term inspection challenge. Koh Young Technology leverages its expertise in 3D measurement and inspection to address the precise inspection of wafer surfaces, critical dimension measurement, defect detection, and the analysis of complex structures found in semiconductor devices.
ZenStar
The ZenStar, making its debut at SEMICON Japan, supports True 3D inspection of highly reflective dice with a mirror surface. Its unparalleled 2D/3D multi-modal technology combines industry-leading Moiré technology and new Koh Young proprietary optics to provide robust and stable inspection for bleeding-edge applications. With its proprietary deep learning technology, the ZenStar offers enhanced capabilities to inspect defect items like micro-cracks, foreign material, and chipping.
Visit Us and Elevate Your Inspection Capabilities
For more information about how Koh Young’s award-winning solutions can elevate your production quality and solve your most challenging inspection needs, visit us at SEMICON Japan Hall 1 Booth 1310. Do not miss this opportunity to engage with our experts, experience our innovative technologies firsthand, and discover how we can help you achieve new levels of efficiency in your manufacturing processes. Learn more about our solutions at www.kohyoung.com
SEOUL, KOREA – Koh Young Technology, the global leader in True 3D measurement-based inspection solutions, is proud to announce that Foxconn honored us on November 15, 2024, with its prestigious 2024 Digital Ecosystem Partner Award. This accolade underscores the strength of the strategic partnership between Koh Young and Foxconn, highlighting Koh Young’s pivotal role in advancing digital transformation and Smart Factory initiatives within the electronics manufacturing industry.
Foxconn, a global leader in manufacturing services, established the Digital Ecosystem Partner Award to recognize organizations that drive seamless integration of technologies and systems across the manufacturing lifecycle. This award celebrates Koh Young’s innovative solutions, which streamline operations and enable data-driven decision-making to enhance product quality and manufacturing efficiency.
A Shared Vision for Smart Manufacturing
A digital ecosystem in manufacturing centers on interconnected technologies that foster real-time insights, optimized processes, and enhanced collaboration. Koh Young has been instrumental in supporting Foxconn’s operations with innovative solutions that seamlessly integrate into their manufacturing processes, enabling real-time quality control and optimizing production efficiency.
Koh Young’s True 3D inspection systems and its KSMART smart factory platform have played a crucial role in helping Foxconn achieve its Smart Factory objectives. By providing actionable data and comprehensive connectivity, Koh Young helps Foxconn drive measurable improvements in productivity and product consistency across its global operations.
Recognizing the Value of Partnership
“This award is a testament to our strong collaboration with Foxconn and our shared commitment to advancing Smart Factory innovations,” said Steven Choi, General Manager Koh Young China. “We are honored to support Foxconn’s vision for a fully connected and optimized digital ecosystem, and we look forward to building on this partnership as we continue to shape the future of electronics manufacturing.”
Driving Innovation Together
In 2024, Koh Young made significant strides in empowering manufacturers with tools and insights to drive Industry 4.0 transformation. From launching new technologies to fostering partnerships with global leaders like Foxconn, Koh Young remains at the forefront of the industry’s digital transformation journey. As Koh Young continues to push the boundaries of electronics manufacturing, this award serves as a powerful reminder of the value of collaboration and the transformative potential of a well-executed digital ecosystem.
With this latest recognition, Koh Young solidifies its reputation as a trusted partner in the manufacturing industry, helping customers optimize productivity and reduce costs through innovative, process-driven solutions. For more information about Koh Young and its solutions, visit www.kohyoung.com
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and Intel Corporation. The incentives, which are part of the CHIPS and Science Act, will support Intel manufacturing projects in in Arizona, Ohio, Oregon, and New Mexico.
“The CHIPS Act incentives finalized today will help spur Intel’s massive investments in domestic chip production, advanced packaging, and innovation, while also strengthening America’s economy, job creation, global competitiveness, and supply chain resilience. We commend Intel for investing ambitiously in these projects and applaud the Commerce Department for advancing critical CHIPS manufacturing incentives and R&D investments.”
The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.
An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.
The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.