CLINTON, NY – Indium Corporation® will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.

Indium Corporation will showcase the following products:

• AuLTRA® Precision Die-Attach Preforms offer the NEW Gold Standard – the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
  • Highly accurate thickness control
  • Precise edge quality
  • Optimized cleanliness
  • Default waffle pack method
  • Available for gold-based alloys
• AuLTRA® 75 is an off-eutectic AuSn preform solution (75Au/25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA® 75 helps improve the operation of these critical technologies by adjusting the final solder joint composition and improving wetting and voiding. The AuLTRA® 75 product line also comes in 78Au/22Sn and 79Au/21Sn compositions.
• AuLTRA® ThInFORMS are 0.00035"-thick (0.00889mm or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA® ThInFORMS help combat common issues such as shorting and poor thermal transfer.
• AuLTRA® Fine Ribbon is the company’s Indalloy®182 fine-grade precision ribbon for high-volume, fully automated laser diode assembly processes. For these auto-feed systems, the precision and high quality of the ribbon and spooling are of the utmost importance along with long, continuous lengths. These features help minimize production downtime and facilitate an efficient, high-throughput process resulting in a high-quality end product and low cost of ownership.
• AuLTRA® 3.2 is an air or nitrogen reflow, water-soluble AuSn solder paste, optimized to handle the elevated processing temperatures of gold-based alloys. Perfect for high-power LED module array assemblies, it ensures consistent and repeatable printing performance, featuring a long stencil life and excellent tack. Along with consistently meeting printing and reflow demands, AuLTRA® 3.2 delivers superb wetting and low voiding.
• AuLTRA®5.1 is a no-clean AuSn solder paste, specifically formulated to endure the higher temperatures required by Au-based alloys. Ideal for high-power LED module array assemblies, this formulation provides a broad processing window and consistent print definition, even for ultra-fine pitches. Additionally, AuLTRA® 5.1 excels in wetting performance and void minimization, while meeting rigorous printing and reflow standards.
• Heat-Spring® is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.

To learn more about Indium Corporation’s precision Au-based preforms, visit www.indium.com/products/solders/gold/gold-preforms or stop by booth #4923 at the show.

January 2025 ― Cranston, Rhode Island USA – AIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the promotion of Kelly Cardone to Vice President, Customer Experience. This promotion highlights AIM’s commitment to offering superior support and customer experience.

Since joining AIM Solder over 18 years ago, Kelly has demonstrated exceptional leadership, a deep understanding of customers’ needs, and an unwavering commitment to delivering exceptional support both internally and externally. In her previous role as Director of Marketing & Customer Experience, Kelly led efforts to establish a positive brand image, instilling trust in customers and ensuring outstanding experiences that have encouraged long-term loyalty.

In her new role as Vice President, Customer Experience, Kelly will continue to champion AIM’s customer-first philosophy, ensuring that every aspect of the customer journey is seamless, efficient, and deeply responsive to their needs. She will drive the strategy for elevating AIM’s customer service, forging stronger relationships with clients, and ensuring that AIM remains at the forefront of providing innovative solutions and personalized support.

“Kelly’s promotion reflects not only her contributions and leadership within the company but also our confidence in her ability to further drive our customer-centric culture as we continue to grow,” said David Suraski, Executive Vice President, Assembly Materials Division.

AIM’s commitment to customer experience goes beyond just providing best in class products—it is about fostering meaningful, lasting partnerships and delivering tailored solutions that help customers succeed. Under Kelly’s leadership, AIM will continue to set the standard for excellence in customer service, ensuring that customers have the resources and support they need to thrive in an ever-evolving industry.

Kelly Cardone can be reached at kcardone@aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.

San Jose, CA — January 2025 — Axxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, is proud to announce that it has received the prestigious 2024 JABIL Strategic Supplier Award. This accolade recognizes Axxon-Mycronic’s exceptional contributions to JABIL’s operations through superior technology, innovation, and customer support.

JABIL, a global manufacturing solutions leader, bestows the Strategic Supplier Award to partners who demonstrate outstanding collaboration, consistently high-quality deliverables, and a shared commitment to operational excellence. Axxon-Mycronic was selected for its ability to provide innovative dispensing solutions that have enhanced JABIL’s manufacturing processes, enabling higher efficiency and improved production outcomes.

“We are honored to receive the 2024 JABIL Strategic Supplier Award,” said Jeff Leal Director, Business Development and Strategy. “This recognition underscores our dedication to delivering world-class solutions that drive success for our partners. Our collaboration with JABIL reflects our shared commitment to excellence and innovation.”

Over the years, Axxon-Mycronic has continued to strengthen its reputation as a trusted supplier of advanced dispensing technologies. By offering tailored solutions designed to meet the specific needs of its clients, Axxon-Mycronic has become a vital partner in addressing the demands of evolving industries, including electric vehicles and semiconductors.

This recognition solidifies Axxon-Mycronic’s position as a key player in the industry and reinforces its commitment to driving innovation and excellence. The company remains focused on fostering long-term partnerships and delivering best-in-class solutions that exceed customer expectations.

For more information about Axxon-Mycronic, visit www.axxonauto.com.

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, lowtemperature, and step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock and thermal cycling performance, and even outperforms SAC305 with optimal process setup.

• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.

• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.

To learn more about Indium Corporation’s solder solutions, visit www.indium.com or visit our experts at NEPCON Japan at booth E66-22.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.