WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer praising finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and Intel Corporation. The incentives, which are part of the CHIPS and Science Act, will support Intel manufacturing projects in in Arizona, Ohio, Oregon, and New Mexico.

“The CHIPS Act incentives finalized today will help spur Intel’s massive investments in domestic chip production, advanced packaging, and innovation, while also strengthening America’s economy, job creation, global competitiveness, and supply chain resilience. We commend Intel for investing ambitiously in these projects and applaud the Commerce Department for advancing critical CHIPS manufacturing incentives and R&D investments.”

The CHIPS Act is on track to strengthen American manufacturing, create jobs, boost economic growth, and promote national security. The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.

The U.S. Department of Commerce previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.

COLORADO SPRINGS, CO – Spectrum Advanced Manufacturing Technologies, Inc. (“Spectrum”), a subsidiary of Ocutrx Technologies, Inc. (“Ocutrx”) and a leader in precision electronics and assemblies manufacturing for over 25 years, today announced it has been named manufacturing partner for D-Orbit USA, the recently formed U.S. member company of Italian space logistics company D-Orbit Group. As part of the partnership, Spectrum is renovating a 7,500 sq ft facility, including the construction of a 2,000 sq ft ISO 8-100,000 Clean Room for assembling multiple satellite buses at once. Spectrum will provide material management, PCBA manufacturing, harness manufacturing, and final assembly of the D-Orbit USA satellite buses.

“We are honored to partner with the highly respected D-Orbit Group as they enter the U.S. market,” said Jeff Gilbert, CEO of Spectrum. “Spectrum and D-Orbit share the same values of dedication to our customers, commitment to a high quality of excellence, and relentless pursuit in pushing innovation forward with never-fail electronics and assemblies. Our partnership is a natural fit and we are happy to dedicate a large portion of manufacturing space for them. We look forward to growing together and making a lasting impact on the burgeoning satellite industry.”

Since its founding in 2011, D-Orbit Group has cemented itself as a market leader in space logistics and transportation, with a lengthy track record of space-proven technologies and successful missions. D-Orbit USA, founded in 2023, will be focused on satellite bus design, manufacturing, and business development in the United States satellite market. Its founding team is comprised of distinguished aerospace executives, including Mike Cassidy, CEO, formerly of Google; Mark Krebs, VP of Guidance and Control, formerly of SpaceX and Amazon’s Kuiper; Miles Gazic, VP of Avionics and Software, formerly of SpaceX; Danny Field, VP of Mechanical Engineering, formerly of OneWeb; and David Harrower, VP of Business Development, formerly of Terran Orbital.

Mike Cassidy, CEO of D-Orbit USA, added, “We are excited to kick off this partnership as high-reliability manufacturing is instrumental to our success, and we are thrilled to have Spectrum as our manufacturing partner. The Spectrum team has been a longtime leader in the production of never-fail satellite electronics and assemblies, which makes us proud to partner together to meet the needs of our customers.”

SANTA CLARA, CA – Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is excited to announce a new partnership with PTEC Solutions, a highly respected provider specializing in design, cable and mechanical assembly services. This strategic collaboration aims to deliver a seamless and comprehensive service offering that caters to the growing needs of customers in the electronics manufacturing industry.

Both companies share a rich history, having been founded 27 years ago by visionary CEOs who continue to lead their businesses with dedication and success. Both companies are experiencing rapid growth, and PTEC Solutions has plans to expand operations by adding additional square footage at their Morgan Hill location, complementing their established facility in Fremont.

The partnership leverages the strengths of both organizations: Absolute EMS will provide cutting-edge assembly services to PTEC Solutions, while PTEC will offer their expertise in design, cable manufacturing, and mechanical assembly to Absolute EMS. Together, the companies are poised to streamline processes, enhance service capabilities, and deliver superior solutions to their clients.

“We are excited to partner with PTEC Solutions, a company whose values and vision align closely with ours,” said Doug Dow, COO of Absolute EMS “By combining our resources and expertise, we are set to provide unmatched, end-to-end services to our customers, all while maintaining our commitment to quality.”

Absolute EMS recently earned its ITAR (International Traffic in Arms Regulations) registration, with its state-of-the-art facility offering touchless electronics contract manufacturing, nitrogen reflow, and a satellite manufacturing model designed to enhance flexibility and efficiency. The company’s capabilities serve a variety of industries, including medical manufacturing, military manufacturing and high-reliability applications, with a focus on printed circuit board assembly in Silicon Valley. Absolute EMS also operates under NAICS code 334418 and is UL Registered.

For more information about Absolute EMS and their expanded service offerings, visit visit www.absolute-ems.com 

CLINTON, NY – Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

The presentation, titled Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging, will explore the latest advancements in low-temperature alloys designed for solder bump or Cu pillar first-level interconnects.

In recent years, more low-temperature alloys and materials—operating below the standard SAC305 processing temperature—have been introduced in printed circuit board assembly. Reducing warpages and energy consumption and creating a processing temperature hierarchy for multiple assembly processes are some of the key drivers for the shift to the use of low-temperature material. There has been a rapid increase in the use of similar alloys or material for first-level interconnect in semiconductor packaging, mainly in the form of solder bump or Cu pillar interconnect.

“In this presentation, we will discuss current available alloys or material that can be suitable candidates for first-level interconnect. We also conducted a survey to understand the challenges, readiness, and need of the industry for using low-temperature material focusing on first-level interconnect,” said Hu. “I’m excited to share our collective expertise with my colleagues as we explore homogeneous or partial mixing of low-temperature solder or mid-temperature solder with current standard Pb-free alloy, which can be critical to the thermal fatigue behavior and reliability of the interconnect.”

As Senior Area Technical Manager for East China, Hu manages the technical support team in East China and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 19 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.