CLINTON, NY – Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

The presentation, titled Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging, will explore the latest advancements in low-temperature alloys designed for solder bump or Cu pillar first-level interconnects.

In recent years, more low-temperature alloys and materials—operating below the standard SAC305 processing temperature—have been introduced in printed circuit board assembly. Reducing warpages and energy consumption and creating a processing temperature hierarchy for multiple assembly processes are some of the key drivers for the shift to the use of low-temperature material. There has been a rapid increase in the use of similar alloys or material for first-level interconnect in semiconductor packaging, mainly in the form of solder bump or Cu pillar interconnect.

“In this presentation, we will discuss current available alloys or material that can be suitable candidates for first-level interconnect. We also conducted a survey to understand the challenges, readiness, and need of the industry for using low-temperature material focusing on first-level interconnect,” said Hu. “I’m excited to share our collective expertise with my colleagues as we explore homogeneous or partial mixing of low-temperature solder or mid-temperature solder with current standard Pb-free alloy, which can be critical to the thermal fatigue behavior and reliability of the interconnect.”

As Senior Area Technical Manager for East China, Hu manages the technical support team in East China and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 19 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

AUSTIN, TX – Flex (NASDAQ: FLEX) today announced that Kevin S. Krumm will join the company as Chief Financial Officer (CFO), effective January 6, 2025. He will succeed Jaime Martinez, interim CFO, who will remain with Flex and support a smooth transition. Reporting to Flex CEO Revathi Advaithi, Mr. Krumm will focus on driving the company's long-term financial strategy and creating shareholder value.

Mr. Krumm joins Flex with more than 20 years of experience across industrial, chemical, and healthcare industries. Previously, he served as Executive Vice President and Chief Financial Officer of APi Group Corporation, a global market-leading business services provider of safety and specialty services. Prior to APi Group, Mr. Krumm had a 15-year tenure at Ecolab Inc. in various roles of increasing responsibility, most recently as Corporate Treasurer and Senior Vice President of Global Financial Shared Services.

"Kevin's demonstrated leadership and success across several industries is well aligned with Flex's strategy," said Revathi Advaithi, CEO, Flex. "I look forward to partnering with Kevin to continue to create shareholder value and drive Flex's long-term financial success."

"I am delighted to be joining the Flex team. Flex is uniquely positioned at the intersection of innovation and operational excellence, with a strong legacy of collaboration and execution," said Mr. Krumm. "I look forward to working with the Flex team to build on its track record of financial performance and continue to deliver shareholder value."

Mr. Krumm holds a bachelor's degree in accounting from the University of Northern Iowa and a master's in business administration from the University of Chicago Booth School of Business.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, has further elevated its quality assurance capabilities with the installation of the cutting-edge DAGE Quadra 5 Pro X-ray System from Nordson TEST & INSPECTION.

This state-of-the-art system, installed at Green Circuits’ advanced manufacturing facility, allows the company to inspect PCBs and components with unmatched accuracy, reduce errors due to board warpage, and streamline workflows for faster turnaround times.

The Quadra 5 Pro offers exceptional inspection performance, enabling Green Circuits to achieve the highest precision in detecting and analyzing defects. With its 3.3 MP ultra-high-quality imaging, sub- micron resolution, and advanced Revalution™ control software, the system delivers highly detailed, accurate images to support key manufacturing processes, including in-line electrical testing, automated visual inspections, and failure analysis.

“We are excited to integrate the Quadra 5 Pro into our inspection processes,” said Mark Evans Chief Operating Officer at Green Circuits. “This technology will enable us to identify and resolve issues with greater precision and efficiency, ensuring that our customers continue to receive products of the highest quality. Its ability to handle complex assemblies aligns perfectly with our mission to support cutting-edge technologies and rapid turnaround demands.”

The Quadra 5 Pro’s features, including optimal clarity from the Onyx™ HL Detector, customizable filtering, and intuitive point-and-click controls, allow Green Circuits to enhance defect analysis and streamline workflows. The system’s oblique angle viewing and anti-vibration capabilities ensure consistent and reliable inspection results, even for the most challenging applications.

As a global EMS leader, Green Circuits offers a comprehensive suite of services, including PCB design and engineering, fabrication, assembly, system and box build, supply chain and logistics, test and burn- in, BGA rework, and failure analysis. With the addition of the Quadra 5 Pro, Green Circuits strengthens its ability to meet the stringent quality and reliability standards required by OEMs in high-tech industries.

For more information, visit www.greencircuits.com 

WASHINGTON – The Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

“We are thrilled to welcome our new chair for 2025, David Goeckeler of Western Digital,” said SIA President and CEO John Neuffer. “David possesses years of experience in the technology and semiconductor industries, and is an outstanding advocate for our work. He will be a fantastic leader of the SIA Board of Directors in 2025.”

Over more than four decades, Goeckeler has focused on innovating and growing industries ranging from semiconductors to global networking to enterprise software. As CEO of Western Digital, Goeckeler has led the company’s transformation as a leading data storage producer in the industry. Prior to this, he served as Executive Vice President and General Manager of Cisco’s Networking and Security Business, after starting his career at Bell Laboratories. Goeckeler was recently appointed Chairman of the U.S. Chamber’s U.S.-Japan Business Council (USJBC).

“Semiconductor innovation is the transformative backbone of everything from the smartphone in your pocket to hyperscale cloud infrastructure to artificial intelligence that uplift society and improve our quality of life,” said Goeckeler. “As we grow our industry, the role of effective government policies is more crucial now than ever to accelerate innovation and expansion in this sector. Through partnership with my colleagues on the SIA Board, I look forward to strengthening our shared industry priorities in Washington and around the world.”