POOLE, UK – Europlacer, a global leader in flexible SMT assembly solutions, is excited to announce its participation at Southern Manufacturing & Electronics 2025, taking place from February 4-6, 2025 at Farnborough International Exhibition and Conference Centre. Visit Europlacer at Booth E80 to explore cutting-edge innovations designed to revolutionize high-mix manufacturing environments.

Europlacer empowers high-mix manufacturers with flexible, efficient, and traceable solutions. At this year’s event, the company will showcase advanced SMT technologies tailored to industries where precision and reliability are paramount. Discover Advanced Solutions at Booth E80

Attendees will have the opportunity to experience live demonstrations of Europlacer’s latest technologies, including:

• ii-P7 Automatic Screen Printer – Ensuring accurate paste deposition for consistent, reliable results in every cycle.
• NEW ii-N1 Placement Machine – Setting new benchmarks in flexibility, precision, and efficiency for high-mix applications.
• ii-Tab Mobility Solution – A mobile tool designed to provide real-time production notifications, enhancing control and responsiveness.
• Freeform Feeder – A groundbreaking solution for loose component handling, improving efficiency and simplifying workflows.
• NEW ii-RC Software Powered by Siemens Valor Process Preparation – Integrating seamlessly with Siemens Valor to enhance process planning and streamline operations.

Don’t miss the chance to see Europlacer’s innovations in action. Join us from February 4-6, 2025, at Booth E80, and discover how Europlacer’s smarter solutions are transforming the high-mix manufacturing landscape.

For more information about Europlacer and its participation in Southern Manufacturing & Electronics 2025, visit www.europlacer.com 

CLINTON, NY – Indium Corporation Senior Technologist Dr. Ronald Lasky and Senior Product Development Specialist Kevin Brennan will deliver a series of presentations at the Pan Pacific Strategic Electronics Symposium (Pan Pac 2025), taking place January 27-30 in Maui, Hawaii.

Dr. Lasky’s first presentation, Electronics: Down Memory Lane and a Vision for the Future, will explore the evolution of electronics, from early vacuum tube technology to modern innovations such as artificial intelligence and robotics. Dr. Lasky will highlight key milestones of technology’s rapid advancements throughout history and discuss how the optimization of resources and advanced AI integration are streamlining and shaping the future of electronics.

The second presentation, titled Low-Temperature Attach: Today and Tomorrow, will focus on advancements in low-temperature soldering technologies, including bismuth-tin alloys and metastable solder pastes. These innovations enable secure interconnections at significantly lower temperatures – crucial for next-generation electronics requiring delicate material handling and enhanced performance.

“For over a century, electronics innovation has been the cornerstone of our ever-evolving tech industry,” said Dr. Lasky. “At Pan Pac, I look forward to discussing the advancements that have brought us to this point, and the promising future ahead.”

Brennan’s presentation, Mastering Complexity: A Solder Material Solution to Manage Component Warpage and Uneven Thermal Gradients in Modern Electronics Manufacturing, addresses the challenges posed by larger, more complex integrated circuit chips and high-density circuit boards, including component warpage and uneven heating during reflow processes. Brennan will highlight the use of a novel, low-temperature alloy that reduces peak reflow temperatures by 20-40°C compared to SAC305. This solution effectively mitigates warpage and enhances manufacturing reliability for modern electronics.

ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce the appointment of Marco Liu as the Senior Sales Manager, effective December 17, 2024. This appointment reflects our commitment to strengthening our presence in the Taiwan market and fostering positive business relationships.

Liu Kang Ping, professionally known as Marco Liu, brings over 20 years of extensive experience in engineering, sales, and management, with a specialisation in the Surface Mount Technology (SMT) industry. With a background in Aeronautical Engineering, Marco began his career as an engineer focusing on Automated Optical Inspection (AOI) testing and process optimisation. His unwavering dedication and perseverance allowed him to develop a profound expertise in SMT, establishing a strong foundation for his professional journey in Taiwan and China.

Throughout his career, Marco has supported major clients across Asia in adopting advanced testing and inspection technologies, including Automated Optical Inspection (AOI), Automated X-ray Inspection (AXI), and In-Circuit Testing (ICT). Collaborating with renowned industry leaders, he has demonstrated exceptional skill in addressing diverse customer needs and cultivating enduring relationships. This blend of technical expertise and a strategic approach to business development has consistently driven growth and strengthened client partnerships across various industries.

Marco begins his journey with ViTrox by dedicating his efforts to supporting the sales of ViTrox’s cutting-edge SMT PCBA vision solutions, including Advanced 3D Solder Paste Inspection (SPI), Advanced 3D Optical Inspection (AOI), Advanced 3D X-ray inspection (AXI), and Advanced Robotic Vision (ARV). In addition to these key product lines, Marco will also be responsible for facilitating the sales activities of VisionXpert in the Taiwan market.

"Marco’s exceptional expertise and commitment to fostering strong client relationships bring immense value to our team. His leadership and in-depth industry knowledge will undoubtedly drive significant growth and innovation for ViTrox in the Taiwan market," said Mr Seow Zi Yang, Director of Business Development & Technical Support, Automated Board Inspection division.

ViTrox welcomes Marco Liu to his new role and looks forward to his contributions to driving growth and innovation within the region. Together, we remain committed to delivering excellence and fostering long-term partnerships with our valued customers.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Austin Expo & Tech Forum on February 6th, or visit www.aimsolder.com