WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the U.S. House of Representatives of the bipartisan Semiconductor Technology Advancement and Research (STAR) Act. The STAR Act extends the duration of the Advanced Manufacturing Investment Credit (AMIC)—a 25% tax credit for chip production—and expands eligibility of the credit to include investments in semiconductor design, the research-intensive mapping of a chip’s intricate circuitry and functionality. Reps. Blake Moore (R-UT), Suzan DelBene (D-WA), Michael McCaul (R-TX), Doris Matsui (D-CA), John Moolenaar (R-MI), and Raja Krishnamoorthi (D-IL) led eight other House members in introducing the legislation. A similar version of the legislation was introduced in the House last year.

“U.S. leadership in semiconductor research, design, and manufacturing is critical to America’s economy, technology leadership, and national security. The CHIPS Act’s investment tax credit has been hugely successful in strengthening America’s semiconductor ecosystem, spurring substantial private investment and helping to put the U.S. on track to more than triple domestic chip manufacturing capacity by 2032, the largest percentage increase in the world. By extending the duration of the credit, the STAR Act would build on this momentum by promoting further growth in chip manufacturing here in the United States.

“By expanding coverage of the credit to include chip design, the STAR Act would ensure the U.S. secures the economic, national security, and first-mover advantages of being the global leader in semiconductor technology. At a time when global competitors are making historic investments in their own chip ecosystems, we urge Congress to pass the STAR Act to help America win the chip race, enhance our economic and national security, and reinforce U.S. semiconductor leadership for years to come.”

The AMIC, codified under Section 48D, has proven to be a powerful incentive for investment in chip fabrication and packaging. It has helped attract $450 billion in private investment and is strengthening our economy, national security, and supply chain resilience. The AMIC expires at the end of 2026, and extending it would allow the U.S. to maintain momentum in reinforcing its domestic chip capabilities.

Despite having built-in advantages in chip design—including being home to the leading chip design companies, the world’s best universities, and a highly skilled workforce—the U.S. is facing challenges to its design leadership and continues to trail the incentives offered by global competitors for innovation in chip design and R&D investments. The STAR Act helps to level the playing field between the U.S. and global competitors and ensure the U.S. retains its first-mover advantage by maintaining America’s technological edge.

Reps. Moore, DelBene, McCaul, Matsui, Moolenaar, and Krishnamoorthi were joined in introduction by Reps. Tenney (R-NY), Khanna (D-CA), Buchanan (R-FL), Morelle (D-NY), Carson (D-IN), Gottheimer (D-NJ), Sewell (D-AL), and Panetta (D-CA).

SIA called for passage of the STAR Act in a policy agenda released earlier this month titled “Winning the Chip Race.”

TROY, MI – Amtech Electrocircuits, a leading provider of manufacturing solutions, is proud to present insights into the key trends driving innovation and growth in 2025. From advanced automation and sustainability to AI integration and supply chain diversification, these trends are setting the stage for the next era of manufacturing excellence.

“These emerging trends align closely with our mission to deliver cutting-edge solutions that enhance efficiency, sustainability, and resilience across the electronics manufacturing industry,” said Jay Patel, CEO at Amtech. “Amtech is here to help our partners seize new opportunities and drive success in 2025 and beyond.”

Top Trends to Watch in 2025:

1. AI and Machine Learning Integration: Transforming processes like predictive maintenance, automated quality control, and production optimization, AI is enhancing efficiency and reducing downtime across the industry.

2. Advanced Automation and Robotics: Collaborative robots (cobots) and lights-out manufacturing are revolutionizing production by enabling autonomous, high- throughput operations with minimal human intervention.

3. Reshoring and Regionalization: Companies are prioritizing local manufacturing to mitigate global uncertainties and build resilient supply chains with faster lead times.

4. Sustainability and Circular Economy: Greener practices, energy efficiency, and resource recycling are driving the shift toward a circular economy, ensuring environmental and economic benefits.

5. Smart Manufacturing and IoT: Real-time data from interconnected devices in smart factories is powering predictive analytics and better decision-making, elevating productivity and quality.

6. Additive Manufacturing (3D Printing): Moving beyond prototyping, 3D printing is enabling the production of complex components with reduced waste, particularly in high-value sectors like aerospace and medical devices.

7. High-Mix, Low-Volume Production: Flexible production systems are meeting the growing demand for customized solutions without compromising efficiency or quality.

8. Enhanced Cybersecurity Measures: With connected systems comes the need for robust cybersecurity to protect sensitive data and ensure operational integrity.

9. Workforce Transformation: Upskilling employees to work alongside advanced technologies and addressing labor shortages through automation are reshaping the manufacturing workforce.

10. Global Supply Chain Diversification: Exploring alternative sourcing strategies and partnerships is critical to building supply chain resilience and agility.

Amtech is dedicated to supporting its customers as they navigate these trends and transform their operations. With innovative solutions tailored to high-mix, low-volume production, sustainability initiatives, and smart manufacturing technologies, Amtech helps businesses embrace change and position themselves as industry leaders.

For more information about Amtech Electrocircuits, please visit www.buildamtech.com 

ATLANTA – ECIA members, electronic component manufacturers and distributors who have international operations face a broad spectrum of cyber risks that could potentially impact their business operations. These risks can be more complex and challenging due to their international scope. The ECIA’s GIPC has posted an advisory report prepared as the result of a cooperative effort between electronic component manufacturers and their authorized distributors.

The four key areas covered by the document are Cyber Threats, International Governance, An International Response Plan and Scheduled Tests, and Allocating Resources to Protect International Operations. This document offers concrete recommendations to enable managers to prepare their organizations.

“Many thanks to the GIPC Cybersecurity subcommittee that worked on researching and updating this critical document,” commented ECIA VP of Industry Practices, Don Elario. “By sharing members’ best practices with the rest of the industry, we can minimize the disruptions that occur from cyber-attacks. These attacks affect everyone.”

The GIPC committee members who worked on this advisory report were:

• Jeff Johnson - Director, IT Security, Privacy and Cyber-Fraud, DigiKey
• Bert Krämer - Senior Vice President IT and CIO, Vishay (recently retired – December 2024)
• Kathy Harp - IT Director, Avnet

The complete GIPC Guidance Document, entitled “International Cyber Security Advisory Report, GIPC No. 102, Edition 2” can be downloaded here.

ATLANTA, GA – Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, is excited to announce its partnership with NTV USA (NexTex Ventures, LLC) to bring its proven inspection technologies to the semiconductor industry. With more than 24,000 systems installed worldwide, Koh Young has earned its reputation for innovation, accuracy, and reliability in the Surface Mount Technology (SMT) sector. Building on its success in SMT, Koh Young has expanded its advanced inspection and metrology solutions to the semiconductor industry, where it is already well- established in Asia. Now, through this strategic collaboration with NTV, Koh Young is making its metrology and inspection technology available to companies in the U.S. engaged in System-in-Package (SiP), Wafer-Level Packaging (WLP), die stacking, and other advanced packaging applications.

Koh Young has developed the Meister Series and ZenStar, advanced metrology and inspection solutions tailored for the semiconductor industry. These systems are purpose-built to address the demanding requirements of advanced processes:

• Meister S: Designed for inspecting SiP and advanced packaging, the Meister S delivers high-precision 3D solder paste inspection with unparalleled accuracy and repeatability, ensuring superior control and yield optimization.
• Meister D: Built to inspect die and discrete components, the Meister D offers a specialized solution for ensuring product quality and reliability in high-volume semiconductor production environments.
• Meister D+: A dedicated inspection solution combining industry-leading Moiré technology and proprietary optics for highly reflective die applications, the Meister D+ provides capabilities for micro features.
• ZenStar: Koh Young’s wafer-level metrology solution, the ZenStar, delivers wafer metrology using proprietary deep learning technology to inspect defects such as micro-cracks, foreign material, chipping, and more.

Backed by Koh Young’s award-winning support organization and NTV’s expertise, this partnership ensures companies have access to industry-leading inspection systems and local sales support to meet their most demanding requirements. Together, Koh Young and NTV are empowering the semiconductor industry with solutions designed to enhance yield, improve control, and drive innovation.

"NTV is proud to partner with Koh Young to bring its advanced metrology and inspection solutions to semiconductor customers implementing a range of Advanced Packaging technologies," said Dean Turnbaugh, President of NTV. "Koh Young's measurement and inspection technologies, proven in the SMT sector, have been enhanced and tailored to meet the unique challenges of the semiconductor industry. We are eager to introduce these solutions to the U.S. market and support semiconductor manufacturers in achieving higher precision, reliability, and efficiency in their processes."

NTV brings a portfolio of semiconductor-related equipment and decades of experience working with both small and large semiconductor equipment companies and customers across the United States. Koh Young is the latest addition to this portfolio. Together, Koh Young and NTV are well-positioned to support your advanced semiconductor manufacturing needs.