HARRISBURG, PA ― March 2025 ― Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, in partnership with Desco Industries Inc., is pleased to announce an upcoming FREE training opportunity on ANSI/ESD S20.20-2021, the globally recognized standard for Electrostatic Discharge (ESD) control programs. This comprehensive course is designed for engineering, quality management, and leadership professionals looking to enhance their expertise in ESD principles and the effective implementation of ESD control programs. To register, visit https://register.gotowebinar.com/register/7058868394476318300?source=Desco-Cumberland.

Participants who successfully complete the full course and related exams will receive a certificate of completion from Desco Industries Inc., recognizing their expertise in ANSI/ESD S20.20-2021 compliance and implementation.

ESD poses a significant risk to electronic components, and implementing a robust control program is essential in preventing costly failures. Unlike standard operator-level training, this course is designed to equip professionals with leadership-level insights into static electricity management and the proper use of ESD control items.

Through this training, participants will gain an in-depth understanding of:

• ESD Basics: The fundamental principles of ESD and its impact on electronics.

• ANSI/ESD S20.20-2021 Standard: A detailed review of technical and administrative requirements.

• ESD Control Items: Proper qualification and verification of key ESD control measures, including grounding, worksurfaces, ionization, seating, shelving, mobile equipment, packaging, garments, and more.

This training will take place over four sessions, covering key aspects of ESD control and compliance:

• Tuesday, April 29, 2025: ESD Basics and Technical & Administrative Review of S20.20-2021

• Tuesday, May 6, 2025: Grounding, Personnel Grounding, Wrist Straps, Continuous Monitoring, Flooring

• Tuesday, May 13, 2025: Worksurfaces, Mobile Equipment, Shelving, Seating

• Tuesday, May 20, 2025: Packaging, Ionization, Garments, Gloves, Finger Cots

Why Attend?

 Advance Your Expertise – Gain a leadership-level understanding of ESD control strategies.

 Strengthen Your ESD Program – Ensure your organization meets and maintains compliance with ANSI/ESD S20.20-2021.

 Earn a Certification – Receive a certificate from Desco Industries Inc. upon completion.

 Completely Free – A valuable professional development opportunity at no cost.

Register now to secure your spot today.

For more information about CE3S and our strategic sourcing, professional solutions, and distribution services, visit www.ce3s.com.

About CE3S

Established in 1962, CE3S has built a legacy as a trusted provider of quality goods and services. Our enduring presence, coupled with the wisdom of our seasoned employees, empowers us to introduce innovative ideas and practical solutions to your everyday procurement needs. With knowledgeable salespeople always ready to assist, CE3S offers an exceptional customer experience with no minimum order constraints, an extensive inventory for a wide selection, and invaluable assistance in part selection and cross-referencing.

SAN JOSE, Calif., March 2025 – Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, appoints Freddie W. Chavez Jr. as Vice President of Business Development. Freddie brings over 20 years of experience in sales and business development, including roles in general management and operations.

In his new role, Freddie will drive Naprotek’s top-line growth by leveraging the company’s unique offering of mission-critical electronic components and assembly services. He will work closely with the executive leadership team to formulate and execute growth strategies that promote its East Coast center of excellence in RF components, micro-e assembly, and fabrication services including wafer dicing, lithography, and thin film circuits, along with our West Coast center of excellence in high-mix, high-complexity PCB assembly, integration, and testing.

Freddie recently served as Director of Corporate Business Development at Stellant Systems and as Senior Vice President at Frontgrade Aethercomm Inc.

Additionally, Freddie has a distinguished military career, having served in the United States Marine Corps for nearly five years. He is a Desert Storm veteran and has received the Navy Achievement Medal and the title of Southwest Asia Marine of the Year.

“We are excited to welcome Freddie to Naprotek,” said Teh-Kuang Lung, President and CEO of Naprotek. “His deep experience in RF technology, strategic customer interface, and leadership in business development will be crucial in advancing our growth across the enterprise. We look forward to the innovative strategies and leadership he will bring to our organization.”

“I am thrilled to join Naprotek and contribute to its continued success,” said Freddie Chavez. “I look forward to working with the talented team at Naprotek to drive growth and deliver exceptional value to our customers.”

For more information about Naprotek and its high-reliability manufacturing services, please visit www.naprotek.com or contact our support team.

About Naprotek

Naprotek is an electronics technology solutions provider for high-reliability applications. Since 1995, Naprotek has delivered complex and custom solutions in the Defense, Space, Medical, and Semiconductor Capital Equipment markets and select applications in Test & Instrumentation and Advanced Technology. Capabilities include quick turn printed circuit board assembly, prototyping, RF components, advanced microelectronics, system integration, and test services. Naprotek is committed to delivering customer value through engineering, supply chain management, and manufacturing support. To learn more visit www.Naprotek.com.

HILLSBORO, OR – The Northwest Electronics Design & Manufacturing Expo (NEDME) is gearing up for its 2025 event, and exhibitor registration is now open! Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center at Westside Commons in Hillsboro, Oregon. This year’s keynote speaker is Quantum Computing hardware expert Jim Clarke.

Going 22 years strong, NEDME remains the Pacific Northwest’s premier trade show for electronics design and manufacturing professionals.

Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now.

Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics and manufacturing sector.

In addition to exhibitor registration, NEDME is accepting applications for breakout speaking sessions. Industry experts and thought leaders are encouraged to apply to present engaging, educational sessions on cutting-edge topics in electronics design, manufacturing and more.

Be a part of the Pacific Northwest’s top electronics industry event!

• Exhibitor Registration & Booth Reservations: Register online at www.nedme.com

• Speaker Applications: Submit proposals at www.nedme.com

• Event Date: Wednesday, October 22, 2025

• Location: Wingspan Event & Conference Center, Hillsboro, OR

If you have questions or need more details – email board@nedme.com.

As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.

Tuesday, March 18

Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.

This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing demonstrating up to a 67% reduction in voids under optimized reflow conditions.

Wednesday, March 19

Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder, presented by Technical Support Engineer Thuy Nguyen, and co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling.

This presentation explores the development of novel mixed-alloy solder paste Durafuse® HR, which reduces voiding while maintaining high-reliability thermal cycling performance, offering improved solutions for automotive, high-performance computing, and 5G communication applications.

Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow presented by R&D Manager Dr. Ian Tevis, co-authored by Dr. Yifan Wu and Radhika Jadhav.

This presentation showcases the development of supercooled solder pastes using core-shell bismuth-tin (BiSn) particles, enabling reliable solder interconnects at temperatures 40°C lower than conventional reflow profiles, making them ideal for future electronics manufacturing and temperature-sensitive applications.

Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II, co-presented by Senior Product Specialist Miloš Lazić and Sunny Agarwal, ITW EAE. Co-authored by Dr. Ricky McDonough.

This presentation examines the advancements in liquid metal paste (LMP) technology, showcasing its enhanced thermal conductivity and adaptability for high-performance computing applications, while addressing challenges associated with traditional liquid metal thermal interface materials (TIMs).

Phase-Change Metal (PCM) TIMs for Enhanced Thermal Management – Part II, presented by Miloš Lazić, co-authored by Dr. Ricky McDonough and Bob Jarrett.

This presentation introduces newly developed gallium-based and gallium-free phase-change metal (PCM) TIMs, designed to remain in a liquid state at operating temperature, delivering exceptionally low thermal resistance. Power cycling and HAST data highlight their robust performance and underscore the necessity of containment strategies, while gallium-free solutions enable compatibility with aluminum heat-sinks.

To learn more about Indium Corporation’s solder and TIMs solutions, visit www.indium.com or visit with our experts at APEX 2025 in booth #1416.

About Indium Corporation

Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/.