Products
The new WaferRepair platform addresses the technology requirements associated with the reliable, cost-effective laser fuse processing of high density DRAM and other memory devices using redundancy, as well as laser programming for device customization and repair of non-memory devices. Delivers refinements in beam placement accuracy, laser spot size and ultra-fine, ultra-stable energy control that enable the processing of extremely tight-pitch fuse structures for yield enhancement. Feature the system precision required by 90-nm and smaller design rules.
Based on the new platform, the M450 fuse processing system features a laser spot size of 1.4 µm. The M455 has a laser spot size of 0.7 µm, enabling aggressive fuse pitch shrinks below 2 µm. Both process fuses at a rate of 60,000 Hz with beam-positioning accuracy of +/- 0.150 µm.
GSI Lumonics Inc., gsilumonics.com
ITT Industries, Cannon now offers many of its switch products in lead-free versions. Many also contain no cadmium, mercury or other toxic substances, such as hexavalent chromium, polybrominated biphenyls or polybrominated diphenyl ethers.
Switches such as the trackball navigation switch, and KMR, KMS, TPC, TPA and KSU tact switches are completely free of all chemicals mentioned above and are completely compatible with lead-free solder processes.
ITT Industries, Cannon, ittcannon.com
Following the adoption of the PumpPrint process from DEK printing machines and the installation of DEK Infinity printers, Tianjin-based OEM HEG has made significant improvements to its adhesive application process yields.
The company uses the machines to apply SMT adhesives for their automotive and consumer electronics products, replacing their SMT dispensers.
Since the installation of the printers, overall production defect rates have dropped to 20-30 ppm, as confirmed by HEG's quality assurance measures, which include 2-D inspection, visual inspection, AOI and electrical test. The company also reports that throughput for boards that require adhesive application has increased to more than 135 PCBs/hr, and over 81,000 adhesive dots/hr.
According to HEG, a major advantage of the PumpPrint process is its ability to operate even in harsh environmental conditions, as the process can adapt to quite a range of temperature and humidity conditions and glue viscosity levels.
HEG currently operates 21 automatic insertion machines, seven fully automatic SMT lines and nine manual assembly lines, reportedly achieving 8.16 million SMD placements/day and 8.68 million insertions/day.
Press Releases
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- Naprotek Appoints James Eisenhaure as Chief Financial Officer
- ViTrox Announces Strategic Partnership with Maxim SMT to Strengthen Presence in India
- Incap UK achieves JOSCAR Zero accreditation – Strengthens its position in the defence and aerospace sector