Products
Dow Corning SE 4451 thermally conductive encapsulant has a pre-qualified, turnkey dispensing process. The combined material-and-process offering is one of the first developments to emerge from the External Equipment Provider Alliance launched by Dow Corning earlier this year.
Designed for the heat-management needs of electronic power devices, the encapsulant offers thermal conductivity of 3W/mK at 25°C and 32,000 cPs viscosity. The material's properties enable fast dispense and cure times.
Dow Corning worked with alliance member and dispensing equipment provider Liquid Control Corp. to develop a turnkey dispensing process for the new encapsulant.
The companies will discuss the product and process during a one-hour online seminar on thermal interface materials on Nov. 11, at 11 a.m. EST. Click for more info.
Version 7.3 of the Trilogy 5000 solution for PCB process preparation and assembly programming operations and the Enterprise 3000 DFM solution for manufacturability and physical design verification of CAD data is now available.
Enhancements to the assembly engineering platform include various feature extensions to the Line Balancing, Documentation Editor and Machine Shapes Manager modules. Siemens SMT machine models S20, S23, S25, HS50, F4 and F5 are now supported..
The updated design environment offers tighter integration to the Cadence Allegro, Mentor Graphics Boardstation and Zuken Board Designer PCB CAD systems. Other extensions to the input/output interfaces include ICT output format. Features BOM and AVL handling, parts library management and DFM with emphasis on Signal Quality Analysis.
Valor Computerized Systems, valor.com
CADSTAR Express, a free Web download of the CADSTAR 7.0 design solution, includes an advanced Place and Route Editor for faster, more accurate routing. The fully functional Web version has a limit of 50 library components and 300 pins.
Aimed at design engineers, board designers, students and hobbyists, comes with an interactive manual to guide users through the design process and tool suite.
Front-to-back design suite for the Windows platform offers constraints-driven schematic capture, placement, routing, library creation and management, signal integrity, EMC analysis and production of manufacturing data. Design flow managed within a single GUI. Menus can be customized for fast access to frequently used tools, includes board dimensioning tools and a hierarchical library for symbols, components and parts.
Said to offer fast, accurate automatic routing of even densely packed boards. Features 45-degree routing, automatic copper re-pour and constraints-based component footprints. Offers placement accuracy up to 1/1000th of a degree, and constraints-based track length control maintains signal integrity and minimizes EMC problems in high-speed designs.
Available for download at cadstarworld.com/express.
Zuken, zuken.com
Press Releases
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- Altus Helps FermionX Enhance Production with Advanced Inspection Solutions; Joe Booth and Will Patrick Comment