Products
Effective January 1, KIC 24/7 continuous thermal process monitoring and traceability system ships standard with KIC Navigator process development and optimization software.
Prior to beginning production, the software selects the oven recipe that positions the thermal process towards the center of the narrow process window. This ensures a stable process while accommodating the natural process drift that exists in any process. It avoids the frequent alarm syndrome caused by a poorly developed initial processes teetering on the edge of the process window. Operates in real-time to warn of an out of control process, and immediately alarms on an out-of-spec situation.
KIC, kicthermal.com
Micro-Lite FL-1000 and FV-1000 ring lights for microscopes now feature full spectrum lighting (FSL) bulbs at no extra charge. FSL contains the entire range of visible wavelengths, so all objects and a wide range of materials can be seen. FSL is critical for lead-free solder connections inspection.
The FL-1000 fluorescent ring illuminator features advanced electronic ballast for control and stability, and dimmable intensity without flickering or humming. The FV1000 offers full intensity variability due to its patented microchip-controlled, dimmable fluorescent technology. Operators can adjust the lighting to their own comfort level. Both are ESD-safe and offer a pluggable bulb design for replacement.
Micro-Lite, micro-lite.com
Three new UV-cure encapsulants for use in Smart Card IC module manufacturing are now available: Hysol 3323, Hysol 3327 and Hysol 3329. Developed using single-component epoxy technology, they reportedly provide faster curing times, improved adhesion, minimized tape warpage and excellent performance during reliability testing, compared to existing UV- or thermal-cure encapsulants.
Designed specifically for the encapsulation of wire-bonded dies used in Smart Card ICs. Hysol 3323 has high viscosity and a thixotropic nature, and is used to form the dam, while Hysol 3327 and 3329 are low viscosity materials used for the fill process. 3329 has a higher Tg of 155°C (compared to 110°C for Hysol 3327) and a higher Shore hardness.
Are easy to dispense, adhere strongly to a range of carrier substrates and possess a low coefficient of thermal expansion (45ppm below Tg and 130ppm above Tg). Typical UV cure times per IC module are 26 to 46 sec., which enables a maximum of 10,000 UPH.
Henkel,
henkelelectronics.com
