Products
LSM-544 Series Laser Scan Micrometers offer accuracy and versatility. Multi-face polygonal mirrors and high-speed motors make the instruments to perform up to 1,600 scans per second. Ideal for measuring items moving on-line at high speed such as fiber extrusions or for measuring vibrating workpieces.
Available in a variety of models for use in applications ranging from measurement of ultra-fine wires (0.005 mm diameter) at very high resolution (0.01 µm) to cylindrical workpieces as large as 120 mm. Other applications include: x- and y-axis measurement of electric cables and fibers, unevenness measurement of film and sheet, sheet thickness measurement, interval measurement of IC chip leads, gap measurement, measurement of laser disk and magnetic disk read/write head movement, pin-and-plug gage measurement and numerous similar tasks.Available with integrated or remote displays depending upon model, accessories include adjustable workstages and fixturing blocks, calibration gage sets and air blow covers. A standard RS-232C interface and SPC output are provided on most models. Dust- and splash-proof IP64-rated models also available.
Mitutoyo America Corp., www.mitutoyo.com
The AirMax VS family now includes a low-profile 3-pair connector. Contains fewer pins per column than other connectors and has a slot spacing of 16.7 mm.
"The low profile of the AirMax VS 3-pair makes it ideal for use in blade servers and storage devices," said John Burkett, product manager. "The small slot spacing creates an open box that allows more airflow and cools the system, reducing the chances of overheating in systems such as servers."
VS System uses air as the dielectric between adjacent conductors, providing high signal density while exhibiting low insertion loss and crosstalk, without the use of metal shields.
The design of Insert Molded Leadframe Assembly (IMLA) enables the same connector to be used for Differential Pair signals, Single Ended signals or power. Combining EMI optimization with the use of air as a dielectric, designers can freely mix Differential Pair, Single Ended signals and power in one connector. Allows for any allocation of signals within one connector, so systems can grow from 2.5Gb/s to 25Gb/s without requiring redesign of the basic platform.
Available in 6 IMLA or 54 positions, 8 IMLA or 72 positions and 10 IMLA or 90 positions.
FCI, www.fciconnect.com
The assembly of bare die in complex package configurations and/or with unique assembly processes is becoming more commonplace. Bare die are also being assembled together with a variety of other components and mechanical parts. Key applications driving this trend include remote sensing, distributed control, identification and 3-D assemblies.
To address the needs of these applications, Hover-Davis and Alphasem have agreed to work closely together to offer customers complete flexible die/component assembly solutions. For feeding bare die and flip chips, Hover-Davis will be providing Direct Die Feeders for integration into the Alphasem Flexline. The Flexline is an adaptable assembly platform capable of a handling a variety of components and processes.
Hover-Davis, www.hoverdavis.com
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