KIC has expanded its library of solder paste process windows within the KIC 2000 software to 788. This number includes reflow and cure specs, as well as a host of new lead-free solder paste process windows.
Macromelt is a low-pressure moulding solution for packaging of vehicle sensors. By replacing conventional sensor enclosures that require potting, it reduces the complexity, time and cost to assemble the large number of sensors required by modern vehicles.
Simultaneously encapsulates the sensor's circuitry and forms the outer shell of the component to enable a self-contained and highly integrated component. The composition of the moulding material, a polyamide hotmelt, is available in a variety of formulations.Compatible with a range of vehicle sensors and highly miniaturised door-handle electronics as well as new technologies such as intelligent battery sensors and screen-mounted antennas with integral cable stress relief. Pre-moulded connectors and sealed units plus grommets and strain relief components can also be manufactured.
Available in translucent amber or black, standard, with a variety of colors available to special order. Resistant to fluids commonly found in automotive environment such as antifreeze, petrol or diesel and hydraulic fluid. Can operate from -40 to +150 ºC.
Henkel, www.electronics.henkel.com
TT Electronics BI Technologies Electronic Component Division recently developed RoHS-compliant thin film resistor networks. The networks are comprised of a matte tin finish over copper lead frame.
"We are pleased to offer RoHS-compliant thin film resistor networks that are both backward compatible with existing leaded solder profiles and forward compatible with lead free solder profiles," said Mike Torres, applications engineer and product marketing manager.To distinguish from existing products, a suffix "LF" is added to existing part numbers. The packing labels will also identify the products as RoHS-compliant. BI will continue to support the original lead-bearing thin film resistor networks as well.
Packaged in all-plastic molded packages, are fully compliant to RoHS Directive 2002/95/EC, with no exemptions. The devices undergo a process of anneal baking after tin-plating to reduce tin whisker growth.
Network series available include 6XX Nichrome on ceramic and SXX Nichrome on silicon families.
BI Technologies, www.bitechnologies.com