Circuits Assembly Online Magazine - Current Issue

Products

Ashburn, VA - Sanmina SCI recently replaced IPA in their existing underside cleaning process with Zestron SW. The switch was prompted by the New Product Introduction Center to reduce the number of solder balls per board to comply with the IPC-610 standard. Various process optimizations with IPA failed which led to the search for a new cleaning agent. Process advantages achieved with the switch include the prevention of solder balls on the boards, a reduction in the consumption of the cleaner, a shorter process time and a higher flash point which led to increased operational safety.

Zestron, zestron.com

As the deadline for lead-free compliance looms, Grayline Inc. has announced that their manufactured flexible tubing products meet these standards. The EU directives apply to a wide range of products, including electrical and electronic equipment in which much of the tubing Grayline manufactures is used.

Grayline uses non-hazardous compounds to produce its PVC flexible tubing and can supply customers with certification of compliance if needed to verify that the compounds used in the manufacturing process are free of hazardous chemicals banned in the standards.

"Companies seeking to give their product the CE mark can feel confident that Grayline manufactured tubing will meet these standards," said Michael A. Mason, president.

Grayline Inc., graylineinc.com

FRANKLIN, MA -- Speedline Technologies will showcase various solutions and technologies in Booth 4D29 at Nepcon Thailand on June 16-19 in Bangkok.

Exhibits and demonstrations include:

The MPM AccuFlex stencil printer, suited for moderate volume high-mix printing. Combines accuracy and flexibility in a compact footprint. Offers a full range of options for future expansion. Designed for production of 8,000 boards per week with two or more product changeovers per shift, the system easily handles boards from 3 x 2" to 23 x 20" and is capable of printing 12-mil pitch devices with consistent accuracy.

The accurate, flexible and configurable Camalot XyflexPro dispensing system features a calibration-free linear gantry drive system, small footprint and ability to meet any application need through easy-to-add options. Whether dispensing micro dots of silver epoxy, solder paste for high-frequency devices and wafer-level packages, adhesive for 0201 components, or underfill for flip-chip packages or flip- chip-on-board, the system provides the accuracy to maintain process control.

The MPM Gel-Flex Tooling System is a cost-effective answer to the challenge of supporting the circuit board during the stencil printing process. Consisting of non-conductive polyurethane elastomer gel enclosed within a durable membrane shell and mounted to a magnetic base, is a true conformal board-support system.

Compressible gel provides gentle compliance to delicate bottom-side components and leads while providing firm support for the entire board surface. Available for AccuFlex, AP Excel, Ultraprint 2000, and UltraFlex BBP printers. Available as an upgrade for those printers as well as the AP Series, Ultraprint 400 and Ultraprint 500 platforms.

Speedline Technologies, http://www.speedlinetech.com