Circuits Assembly Online Magazine - Current Issue

Products

MYDATA automation AB announces a new version of its machine control software: TPSys 2.4.3. Designed for high-mix production with sophisticated vision technology and networking capabilities. New features include faster assembly speed and a new calibration method (patent pending).

Placement area calibration methods tend to depend on large, dot-matrix calibration boards that are difficult to manufacture accurately, and are very sensitive to heat and moisture. The new calibration method utilizes a much smaller calibration device that is automatically moved to a number of predefined positions within the placement area. An advanced mathematical algorithm then combines the measurements from each position and calculates the correction data for the entire area. The result is more accurate calibration, using a calibration device that is insensitive to handling and storage conditions. A number of functions for faster assembly speed have also been implemented. Improvements such as faster tool changes, faster conveyor board changes and faster board level measurement, along with improved optimization, can reportedly boost actual throughput by up to 15%. Features a simplified user interface for operators, and auto-teach of components up to 132 x 26 mm

Developments in the field of electronics manufacturing are characterized by growing demands on quality and throughput rate, as well as the increased use of miniaturization. Automatic optical inspection (AOI) has become one of the pre-requisites in satisfying the demand for zero-defect manufacturing concepts, particularly in small to medium-sized electronics production facilities. Viscom has responded to the requirements of the market and, with the S3088AV, now proudly offers a new AOI system with an attractive price-performance ratio.

S3088AV is a cost-optimised system with full reflow inspection capability. The inspection of PCBs is operated in single track mode, enabling the inspection of assemblies up to 400 x 350 mm (14.7 x 13.8"). Full program compatibility with the S6055 is guaranteed.

The 4M sensor technology is also used in this system, detecting defects in paste print, component placement and solder joints. The additional use of angled camera modules ensures full-depth inspection and detection of critical errors, such as lifted leads in the fine pitch range.

Further highlights include quick and easy program creation using EasyPro and simple program transfer. Additional modules are also available, including a rework station, post-classification station and off-line programming and SPC analysis.

Viscom AG, www.viscom.de

BP-3106 BGA Bumping Solder Paste produces large deposits of solder material in bumping and other applications using only an SMT printer with a bumping stencil.

Applied using existing equipment, increasing the BGA substrate panel size and printing speed without extra investment in equipment such as BGA ball placement hoppers.

Said to exhibit excellent release properties, robust slump resistance and ultra-low voiding. Can be used for both area array and peripheral BGAs and passes SIR before and after cleaning.

Standard packaging includes 500 g jars and 700 g Semco cartridges. Can be applied using an enclosed printhead such as DEK's ProFlow and MPM rheo pump.

Indium Corp., www.indium.com