Products
Total Parts Plus’ material content database has expanded its coverage for electronic and non-electronic components to more than 2.5 million part numbers. Data coverage includes full and partial content information, Restriction of Hazardous Substances (RoHS) compliancy flags, lead-free identification, exemption tracking, compliant alternates, tin whiskering data and reflow temperature.
Total Parts Plus has been collecting material content data since the announcement of the European Directives and has added RoHS compliancy flags to its material disclosure information to help manufacturers identify compliant replacements quickly.
Total Parts Plus, totalpartsplus.comLibra Industries has introduced a lead-free transition services package to help manufacturers extend their internal engineering capacity to successfully comply with the RoHS directive.
The package consists of in-house BOM review and conversion, and assistance with product redesign though Libra’s Design Service. The company has partnered with Engent Inc. (Norcross, GA) to offer pilot assembly and reliability testing for new lead-free product designs. These services are available a la carte, or as a complete package.
Libra Industries, libraind.com
DEK will show its cost-saving, throughput-enhancing packaging technologies at booth #7111 during Semicon West in San Francisco.
The company will demonstrate its backside wafer coating process, which is said to allow high throughput on a cost-effective mass imaging system and is capable of exceeding the +/- 12.5mm Total Thickness Variation (TTV) required by most wafer processing manufacturers.
Enabled by metal stencil and emulsion screen technologies, materials can be deposited accurately at high speeds, while achieving control over print thickness and ensuring uniformity. This process will be shown on the Micron-class Galaxy printer platform.
Other packaging applications on display will include: Thermal Interface Material (TIM) imaging and wafer bumping solutions enabled by ProFlow DirEKt Imaging technology; encapsulation that only requires one print stroke; singulation technology utilizing Virtual Panel Tooling (VPT); repeatable ball placement technology and high speed substrate bumping.
DEK, dek.com
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S