Circuits Assembly Online Magazine - Current Issue

Products

HOUSTON — BP Microsystems, a supplier of device programming systems, announced the release of its BP Win 4.52 and BP Dos 3.89, which offer additional support for the MAX II CPLD family from Altera.

MAX II devices enable designers to use MAX II devices in place of higher-cost or higher-power ASSPs and standard logic devices. The device family is supported on BP Microsystems' full line of device programmers in the 100 TQFP, 144 TQFP and 256 FBGA package styles. Support for the 324 FBGA package style is scheduled for release this week.

BP Microsystems, www.bpmicro.com

The TCJ Series low-profile tantalum solid electrolytic chip capacitor with a conductive polymer electrode meets the lead-free 3 x 260°C reflow requirements. Said to offer lower ESR, safer non-ignition failure mode and better capacitance retention compared to other polymer devices and conventional MnO2 electrode capacitors, all in a low-profile size (1.2 mm height) for use in portable and handheld devices (cellular phones, PDAs and digital cameras).

Suitable for power management systems with operating temperatures up to 125°C. Offer a capacitance range of 10mF to 100mF.

AVX Corp., www.avx.com

Elkton, MD -- W. L. Gore & Associates, a supplier of cable assemblies, and FCI offer the next generation of high data rate digital interconnect solutions. The data link leverages the advantages of FCI's AirMax VS high-speed connection system with Gore's cable assembly development. The new configuration uses the AirMax connector concept to provide high-frequency performance without the use of shielding. Target markets include telecommunications, large scale computing,and automatic test equipment.

"We are pleased to bring together FCI's expertise in high speed connector design with Gore's high data rate cable technology to offer a data link that can provide an aggregate bandwidth of 1.0 Terabit per second using only 50 linear millimeters of backplane space," said David Gioconda, global data communications market segment leader for Gore. "This technology is ideal for large scale servers, telecom switches and other data intensive hardware."

The cable assembly uses cable with expanded polytetrafluoroethylene (ePTFE) as the dielectric core. The helically wrapped core ensures constant impedance throughout the length of the cables with stability with temperature cycling or flexing. Their smaller diameter and minimum bend radius reportedly allows more signal lines per area and delivers higher bandwidth performance than comparable cable configurations.

Offer low signal loss, low crosstalk, low skew, controlled capacitance and controlled impedance.

The connectors are offered in multiple configurations: 5, 4 and 3 pair per column versions and in a variety of column counts including 10, 8 and 6.

W. L. Gore & Associates, www.gore.com