Products
Datacon has added Laurier’s ultra high precision flip chip die bonder to its portfolio. Designed to meet the needs of high accuracy bonding applications, specifically in the optoelectronics and semiconductor industries, the M9 delivers sub micron resolution (0.5 micron placement accuracy).
Michael Auer, VP of sales at of Datacon, believes that the M9 will prove to be a popular choice for universities and other research establishments: “The M9 is incredibly flexible and comes in a manual option which keeps the cost low. It is also very easy to use so that with as little as a day’s training a student or technician can operate the basic system. Its small foot print means that it takes up very little clean room space.”
Other features include; handling forces of up to 200Kg, temperatures of up to 500°C, Split Optics System and Brightfield/Darkfield Illumination, Air Bearing Components, Tip/Tilt adjustment, Closed Loop Feedback Temperature and Force Maintenance, Motorized Stages and Windows XP.
Typical application areas include optoelectronics (transmitters, receivers, MEMS, pump lasers, detectors) and semiconductors, low force focal plane arrays, LCD displays, automotive, RF devices and biomedical applications.
Datacon, datacon.at
Laurier, laurierinc.com
Assembléon expanded its M-Series pick-and-place machines with the MG-8, extending its capability to deliver standalone or multi-machine line solutions to high-end, mid-volume manufacturers.
With the same look and feel as the MG-1, MG-8 is equipped with three servo-controlled FNC (flying nozzle change) heads, each carrying six nozzles, and a new area CCD camera. Component range extends from 01005 to 55 mm sq. fine-pitch to oddforms with height up to 25.5 mm. Precision z-force control delivers snap-in force for connectors and handling of 01005s.
Achieves accuracy ratings of 50 microns for chips and 30 microns for QFPs, placement speed for ICs and QFPs is 8.4k cph. Has twin board support system with double, independent push-up units.
Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. The feeders are equipped with RFID technology to simplify machine set-up and provide real-time component inventory management. Feeder trolleys can be set up and verified off-line for fast changeover. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers.
Coplanarity system checks three components simultaneously; a side viewing camera option verifies 01005 or 0201 presence at the nozzle while the heads fly over the line array camera for component recognition. A nozzle cleaning system prevents nozzle contamination for improved quality and reduced maintenance.
Assembléon, assembleon.com
With the same look and feel as the MG-1, MG-8 is equipped with three servo-controlled FNC (flying nozzle change) heads, each carrying six nozzles, and a new area CCD camera. Component range extends from 01005 to 55 mm sq. fine-pitch to oddforms with height up to 25.5 mm. Precision z-force control delivers snap-in force for connectors and handling of 01005s.
Achieves accuracy ratings of 50 microns for chips and 30 microns for QFPs, placement speed for ICs and QFPs is 8.4k cph. Has twin board support system with double, independent push-up units.
Accommodates 90 smart feeders along with stick, bulk and tray feeding solutions. The feeders are equipped with RFID technology to simplify machine set-up and provide real-time component inventory management. Feeder trolleys can be set up and verified off-line for fast changeover. A large component sequencer contains 60 pallets, with two in-line loading heads doubling the rate of delivery of components to the machine. An automatic tray stacker holds up to 30 trays in quick-change containers.
Coplanarity system checks three components simultaneously; a side viewing camera option verifies 01005 or 0201 presence at the nozzle while the heads fly over the line array camera for component recognition. A nozzle cleaning system prevents nozzle contamination for improved quality and reduced maintenance.
Assembléon, assembleon.com
The Quadris-S four-gantry placement machine, with built-in turret technology, leverages advanced motion controls to achieve a high throughput-per-machine footprint and a wide part range without changing heads. Has 100ppm final placement performance.
Combines 80,000 cph placement performance, 0201 to 44 x 44 mm component range, support for tape and tray feeders including dual-track feeders, automatic board centering between feeder banks, on-the-fly gang recognition and bank feeder change. In addition to high-speed placement of SMDs as small as 0201, fine pitch capabilities support BGA or leaded packages of 0.5 mm pitch, with ball diameters down to 0.3 mm or leads 0.18 mm wide.
“The Quadris concept concentrates turret-style and gantry placement capabilities into a far smaller footprint than discrete inline machines capable of comparable throughput,” said Prashant Vithlani, Product Manager. “Quadris-S now extends this performance-per-square-meter advantage by boosting throughput and supporting an even wider range of component sizes. This also simplifies scheduling of assemblies, and enhances line balancing and utilization because fewer large components must be placed further down the line.”
Includes direct drive, linear motion, linear sensor and gang recognition. Options include bad board reject, extended BGA/CSP options and 610 x 460 mm board handling. Other options: library data teach, pattern program data teach, automatic component validation (ACV) and an offline feeder setup station.
Comes with UCT-53 offline programming software, and runs on Windows XP.
High-speed linear motors with 0.0048 micron resolution ensure fast, accurate x-y motion. Inter-axis correction control for the y-axis, combined with twin drives, ensure accuracy and repeatability. Each gantry has a compact, direct drive 12-spindle head featuring low weight and inertia, high resolution, high speed and high reliability. Has theta resolution of 0.0027° and a z-height resolution of 1 micron. On-the-head linear CCD sensors provide automatic placement height optimization. The sensing system can detect missing and vertical components, and measures component thickness, to automatically adjust the height control.
Non-stop on-the-fly gang recognition of up to 12 components at high speed enables synchronous control of all four x-y gantries. Productivity Shift board transfer system centers the PCB between feeder banks for optimal balancing across the beams. Bank feeder change and splicing capabilities facilitate rapid replenishment and product changeovers.
Universal Instruments, uic.com
Combines 80,000 cph placement performance, 0201 to 44 x 44 mm component range, support for tape and tray feeders including dual-track feeders, automatic board centering between feeder banks, on-the-fly gang recognition and bank feeder change. In addition to high-speed placement of SMDs as small as 0201, fine pitch capabilities support BGA or leaded packages of 0.5 mm pitch, with ball diameters down to 0.3 mm or leads 0.18 mm wide.
“The Quadris concept concentrates turret-style and gantry placement capabilities into a far smaller footprint than discrete inline machines capable of comparable throughput,” said Prashant Vithlani, Product Manager. “Quadris-S now extends this performance-per-square-meter advantage by boosting throughput and supporting an even wider range of component sizes. This also simplifies scheduling of assemblies, and enhances line balancing and utilization because fewer large components must be placed further down the line.”
Includes direct drive, linear motion, linear sensor and gang recognition. Options include bad board reject, extended BGA/CSP options and 610 x 460 mm board handling. Other options: library data teach, pattern program data teach, automatic component validation (ACV) and an offline feeder setup station.
Comes with UCT-53 offline programming software, and runs on Windows XP.
High-speed linear motors with 0.0048 micron resolution ensure fast, accurate x-y motion. Inter-axis correction control for the y-axis, combined with twin drives, ensure accuracy and repeatability. Each gantry has a compact, direct drive 12-spindle head featuring low weight and inertia, high resolution, high speed and high reliability. Has theta resolution of 0.0027° and a z-height resolution of 1 micron. On-the-head linear CCD sensors provide automatic placement height optimization. The sensing system can detect missing and vertical components, and measures component thickness, to automatically adjust the height control.
Non-stop on-the-fly gang recognition of up to 12 components at high speed enables synchronous control of all four x-y gantries. Productivity Shift board transfer system centers the PCB between feeder banks for optimal balancing across the beams. Bank feeder change and splicing capabilities facilitate rapid replenishment and product changeovers.
Universal Instruments, uic.com
