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Products

DX dispensing system includes a mobile hand-held dispenser with a refill station, for two-component material dispensing.

Can dispense 1:1, 1.5:1, 2:1, 4:1 and 10:1 ratios for two-component reactive resins. Multiple hand-held dispensers can quickly be refilled with one DXR refill station. The refill station uses two transfer pumps that feed from five-gallon bulk containers of material, each equipped with follower plates to handle a range of viscosities. Is lightweight, compact.

MIXPAC Equipment, mixpacequipment.com

ESD Drawer Storage Cabinets are certified to meet specific electrical property requirements, assuring static dissipation at a safe rate. Can be protected by static dissipative powder coat finishes in five standard colors. Drawer interiors can contain conductive plastic boxes and conductive slotted grooved trays for additional protection.

Cabinet drawers feature a 440 lb. load capacity each and are available in seven full sidewall heights for maximum cubic storage capacity. Extend 100% from the housing for complete use of the furthest corners and easy accessibility to all the contents.

Additional ergonomic and safety features include drawer handles positioned at the top of each drawer and flush with the face of the housing. Also, the one-drawer-at-a-time PrevenTip safety system prevents accidental cabinet tipping.

Lista International Corp., listaintl.com

AlSiC (Aluminum Silicon Carbide) metal matrix composite provides lids, or heat spreaders, for the flip-chip IC packaging and optoelectronic market.

Enables a tailored coefficient of thermal expansion, offering compatibility with various electronic devices and assemblies. Unlike traditional packaging materials, the isotropic CTE value can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. Eliminates the need for thermal interface stacking.

Said to exhibit a high thermal conductivity for efficient thermal dissipation. Prevents the bowing and flexing of packaging and substrate material that can lead to failure.

The net-shape fabrication process produces the composite material and fabricates the product geometry. Allows rapid prototyping for high volume advanced thermal management solutions. Less dense than traditional flip-chip packaging materials.

The unrestricted geometry enables the inclusion of complex features, such as capacitor or resistor pockets, in the flip-chip lids. The cast surface supports various identification methods including laser marking, paint, ink and screen printing, as well as plating anodization and other surface metallization schemes typically applied to aluminum. Enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes.

CPS Corp., alsic.com