GÖPEL electronic has introduced a new series of specific JTAG/Boundary Scan controllers with PXI Express interface as part of the Boundary Scan hardware platform Scanflex. The prototype of the new controller family (SFX controllers), SFX/PXIe1149-(x), includes three models for different performance classes.
After SFX controllers for PCI, PXI, USB/LAN and FireWire, the new series is the fifth family of controllers – available in performance classes A, B and C. The models differ in the maximum TCK frequency (20, 50, and 80 MHz, respectively) and in the degree of implementation of the enhanced Space chip set for high performance scan operations. Integrated Fastscale technology allows an upgrade of the controller’s performance class on the fly, without mounting additional hardware.
The x1 configuration achieves transfer rates up to 264 MB/s in “zero wait state burst mode” and is based upon the PXI Express hardware specification 1.0, with support for defined Local Bus, trigger, and synchronisation methodologies. In combination with additional modular components, PXI Express based high performance Boundary Scan systems with up to eight test access ports (TAPs) can be configured and synchronised with other functional modules. All TAPs provide programmable input and output voltage as well as programmable input and output impedance. 32 dynamic I/O, two analog I/O channels, three static I/O and trigger lines are standard features.
Sales of Cookson EAM’s high reliability Alpha Vaculoy SACX now account for 46% of its lead-free bar sales in Europe. “Since its introduction in early 2004, sales of SACX have grown steadily, and over the last six months we have experienced growth as our customers are looking for the high performance, reliability and value they find only in SACX," said Gerry Campbell, global product manager. "The recent increases in the prices of tin and silver have forced our customers to look at lower cost alternatives to reduce the cost burden of moving to Pb-free processes. SACX costs 30% less per kg…without compromising process yield or reliability." Its fast wetting speed and improved solderability reportedly outperforms all Sn/Cu-based alloys. Is said to provide excellent drainage and minimize bridging defects. Creates strong, mechanically sound joints with long-term reliability. Minimizes dross generation, resulting in low process maintenance and reduced product waste. Its process window supports the use of a range of flux technologies.
No. 926 is an electrically-heated, 250°F shelf oven from Grieve, currently used for aging electrical components. 12kW installed in Nichrome wire elements provide heat to the load. Workspace measures 68 x 30 x 66”. A 1000 CFM, 1 HP recirculating blower provides horizontal airflow.
Shelf oven features 4” insulated walls, aluminized steel interior and exterior, plus a 20 x 56” double-pane Lexan window in each of the unit’s two doors.
Includes a disposable fresh air filter, digital indicating temperature controller, manual reset excess temperature controller with separate contactors, recirculating blow airflow safety switch and a remote control panel.